Conference Paper: Comparison of somatosensory evoked potentials components with and without contact cold pain stimulus

TitleComparison of somatosensory evoked potentials components with and without contact cold pain stimulus
Authors
Issue Date2008
PublisherBiomedical Division, Hong Kong Institution of Engineers
Citation
The 2008 Hong Kong Biomedical Engineering International Conference (BME 2008), Hong Kong, 23-25 October 2008. In Conference Proceedings, 2008, p. 12 How to Cite?
DescriptionConference Theme: Converging Frontiers in Biomedical Engineering from Novel Research to Patient Benefits
Section B - Medical Imaging: no. B-5
Persistent Identifierhttp://hdl.handle.net/10722/62584
ISBN

 

DC FieldValueLanguage
dc.contributor.authorHu, Len_HK
dc.contributor.authorHu, Yen_HK
dc.contributor.authorChang, CQen_HK
dc.contributor.authorLuk, KDKen_HK
dc.date.accessioned2010-07-13T04:04:27Z-
dc.date.available2010-07-13T04:04:27Z-
dc.date.issued2008en_HK
dc.identifier.citationThe 2008 Hong Kong Biomedical Engineering International Conference (BME 2008), Hong Kong, 23-25 October 2008. In Conference Proceedings, 2008, p. 12-
dc.identifier.isbn9789627619352-
dc.identifier.urihttp://hdl.handle.net/10722/62584-
dc.descriptionConference Theme: Converging Frontiers in Biomedical Engineering from Novel Research to Patient Benefits-
dc.descriptionSection B - Medical Imaging: no. B-5-
dc.languageengen_HK
dc.publisherBiomedical Division, Hong Kong Institution of Engineers-
dc.relation.ispartofProceedings of Hong Kong Biomedical Engineering International Conference, BME 2008-
dc.relation.ispartofBME2008香港, 國際生物醫學工程會議 : [會議論文集] : 先鋒匯粹 - 以科研惠澤社群-
dc.titleComparison of somatosensory evoked potentials components with and without contact cold pain stimulusen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailHu, Y: yhud@HKUCC.hku.hken_HK
dc.identifier.emailChang, CQ: cqchang@eee.hku.hken_HK
dc.identifier.emailLuk, KDK: hrmoldk@hkucc.hku.hken_HK
dc.identifier.hkuros166216en_HK
dc.identifier.hkuros165280-
dc.identifier.spage12-
dc.identifier.epage12-
dc.publisher.placeHong Kong-
dc.description.otherBiomedical Engineering International Conference (BME2008), Hong Kong, 23-25 October 2008. In Proceedings of BME2008-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats