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Conference Paper: A Novel Surface Modified Biodegradable Metallic Material for Orthopaedic Implantation

TitleA Novel Surface Modified Biodegradable Metallic Material for Orthopaedic Implantation
Authors
Issue Date2008
PublisherHong Kong Institution of Engineers (HKIE).
Citation
Proceedings of BME2008 Hong Kong Biomedical Engineering International Conference: converging frontiers in biomedical engineering from novel research to patient benefits, Hong Kong, 23-25 October 2008, p. 25 How to Cite?
DescriptionOral Presentation - Concurrent Session E: Biomaterials and Tissue Engineering (II)
Persistent Identifierhttp://hdl.handle.net/10722/62574
ISBN

 

DC FieldValueLanguage
dc.contributor.authorWong, HM-
dc.contributor.authorYeung, KWK-
dc.contributor.authorLam, KO-
dc.contributor.authorChu, PK-
dc.contributor.authorLuk, KDK-
dc.contributor.authorCheung, KMC-
dc.date.accessioned2010-07-13T04:04:15Z-
dc.date.available2010-07-13T04:04:15Z-
dc.date.issued2008-
dc.identifier.citationProceedings of BME2008 Hong Kong Biomedical Engineering International Conference: converging frontiers in biomedical engineering from novel research to patient benefits, Hong Kong, 23-25 October 2008, p. 25-
dc.identifier.isbn9789627619352-
dc.identifier.urihttp://hdl.handle.net/10722/62574-
dc.descriptionOral Presentation - Concurrent Session E: Biomaterials and Tissue Engineering (II)-
dc.languageeng-
dc.publisherHong Kong Institution of Engineers (HKIE).-
dc.relation.ispartofBME 2008: Hong Kong Biomedical Engineering International Conference-
dc.titleA Novel Surface Modified Biodegradable Metallic Material for Orthopaedic Implantation-
dc.typeConference_Paper-
dc.identifier.emailYeung, KWK: wkkyeung@hkucc.hku.hk-
dc.identifier.emailLuk, KDK: hrmoldk@hkucc.hku.hk-
dc.identifier.emailCheung, KMC: cheungmc@hku.hk-
dc.identifier.authorityYeung, KWK=rp00309-
dc.identifier.authorityLuk, KDK=rp00333-
dc.identifier.authorityCheung, KMC=rp00387-
dc.identifier.hkuros166316-
dc.identifier.hkuros166236-
dc.identifier.spage25-
dc.identifier.epage25-
dc.publisher.placeHong Kong-

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