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Conference Paper: New simulation methodology of 3D surface roughness loss for interconnects modeling

TitleNew simulation methodology of 3D surface roughness loss for interconnects modeling
Authors
Issue Date2009
PublisherIEEE.
Citation
The 2009 Design, Automation & Test in Europe Conference & Exhibition (DATE '09), Nice, France, 20-24 April 2009. In Design, Automation, and Test in Europe Conference and Exhibition Proceedings, 2009, p. 1184-1189. How to Cite?
AbstractAs clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accounting for accurate prediction of signal integrity and energy consumption. Existing techniques based on analytical approximation often suffer from a narrow valid range, i.e., small or large limit of roughness. In this paper, we propose a new simulation methodology for surface roughness loss that is applicable to general surface roughness and a wide frequency range. The method is based on 3D statistical modeling of surface roughness and the numerical solution of scalar wave modeling (SWM) with the method of moments (MOM). The spectral stochastic collocation method (SSCM) is applied in association of random surface modeling to avoid the time-consuming Monte-Carlo (MC) simulation. Comparisons with existing methods in their respective valid region then verify the effectiveness of our approach. © 2009 EDAA.
Persistent Identifierhttp://hdl.handle.net/10722/61993
ISBN
ISSN

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_HK
dc.contributor.authorWong, Nen_HK
dc.date.accessioned2010-07-13T03:51:42Z-
dc.date.available2010-07-13T03:51:42Z-
dc.date.issued2009en_HK
dc.identifier.citationThe 2009 Design, Automation & Test in Europe Conference & Exhibition (DATE '09), Nice, France, 20-24 April 2009. In Design, Automation, and Test in Europe Conference and Exhibition Proceedings, 2009, p. 1184-1189.-
dc.identifier.isbn978-1-4244-3781-8-
dc.identifier.issn1530-1591-
dc.identifier.urihttp://hdl.handle.net/10722/61993-
dc.description.abstractAs clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accounting for accurate prediction of signal integrity and energy consumption. Existing techniques based on analytical approximation often suffer from a narrow valid range, i.e., small or large limit of roughness. In this paper, we propose a new simulation methodology for surface roughness loss that is applicable to general surface roughness and a wide frequency range. The method is based on 3D statistical modeling of surface roughness and the numerical solution of scalar wave modeling (SWM) with the method of moments (MOM). The spectral stochastic collocation method (SSCM) is applied in association of random surface modeling to avoid the time-consuming Monte-Carlo (MC) simulation. Comparisons with existing methods in their respective valid region then verify the effectiveness of our approach. © 2009 EDAA.-
dc.languageengen_HK
dc.publisherIEEE.-
dc.relation.ispartofDesign, Automation, and Test in Europe Conference and Exhibition Proceedings-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.titleNew simulation methodology of 3D surface roughness loss for interconnects modelingen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailChen, Q: quanchen@eee.hku.hken_HK
dc.identifier.emailWong, N: nwong@eee.hku.hken_HK
dc.identifier.authorityWong, N=rp00190en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/DATE.2009.5090842-
dc.identifier.scopuseid_2-s2.0-70350043883-
dc.identifier.hkuros155077en_HK
dc.identifier.spage1184-
dc.identifier.epage1189-
dc.customcontrol.immutablesml 160111-

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