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Conference Paper: Handling of multi-reflections in wafer bump 3D reconstruction

TitleHandling of multi-reflections in wafer bump 3D reconstruction
Authors
Keywords3D reconstruction
Binary pattern projection
Multi-reflection
Wafer bump
Issue Date2008
Citation
Conference Proceedings - Ieee International Conference On Systems, Man And Cybernetics, 2008, p. 1558-1561 How to Cite?
AbstractIn advanced electronic manufacturing that involves say die-to-die bonding, microscopic surfaces like solder bumps on wafers have to be inspected in 3D. However, because the bumps are of hemispherical shape, light projected onto the bumps could be reflected and illuminate other regions. Such multi-reflections could greatly disturb the intensity distribution in the image data and limit the use of gray level intensities for accurate 3D reconstruction of the bumps. In a previous work, we described a new solution mechanism that was based upon the concept of binary pattern projection, but unlike the traditional mechanisms which use an array of light sources it uses only a single light source. The light source in combination with a binary fringe grating could induce binary pattern on the target surface to be imaged, and the displacements of the binary fringe grating could allow the binary pattern to be varied. In this work, we describe under that solution framework how multi-reflections could be detected and the correct binary signals could be restored. Experimental results on solder bumps validate the feasibility of the proposed approach. © 2008 IEEE.
DescriptionInternational Conference on Systems, Man and Cybernetics
Persistent Identifierhttp://hdl.handle.net/10722/61958
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorCheng, Jen_HK
dc.contributor.authorChung, Ren_HK
dc.contributor.authorLam, EYen_HK
dc.contributor.authorFung, KSMen_HK
dc.date.accessioned2010-07-13T03:50:59Z-
dc.date.available2010-07-13T03:50:59Z-
dc.date.issued2008en_HK
dc.identifier.citationConference Proceedings - Ieee International Conference On Systems, Man And Cybernetics, 2008, p. 1558-1561en_HK
dc.identifier.issn1062-922Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/61958-
dc.descriptionInternational Conference on Systems, Man and Cyberneticsen_HK
dc.description.abstractIn advanced electronic manufacturing that involves say die-to-die bonding, microscopic surfaces like solder bumps on wafers have to be inspected in 3D. However, because the bumps are of hemispherical shape, light projected onto the bumps could be reflected and illuminate other regions. Such multi-reflections could greatly disturb the intensity distribution in the image data and limit the use of gray level intensities for accurate 3D reconstruction of the bumps. In a previous work, we described a new solution mechanism that was based upon the concept of binary pattern projection, but unlike the traditional mechanisms which use an array of light sources it uses only a single light source. The light source in combination with a binary fringe grating could induce binary pattern on the target surface to be imaged, and the displacements of the binary fringe grating could allow the binary pattern to be varied. In this work, we describe under that solution framework how multi-reflections could be detected and the correct binary signals could be restored. Experimental results on solder bumps validate the feasibility of the proposed approach. © 2008 IEEE.en_HK
dc.languageengen_HK
dc.relation.ispartofConference Proceedings - IEEE International Conference on Systems, Man and Cyberneticsen_HK
dc.subject3D reconstructionen_HK
dc.subjectBinary pattern projectionen_HK
dc.subjectMulti-reflectionen_HK
dc.subjectWafer bumpen_HK
dc.titleHandling of multi-reflections in wafer bump 3D reconstructionen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailLam, EY:elam@eee.hku.hken_HK
dc.identifier.authorityLam, EY=rp00131en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/ICSMC.2008.4811508en_HK
dc.identifier.scopuseid_2-s2.0-69949184020en_HK
dc.identifier.hkuros158733en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-69949184020&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage1558en_HK
dc.identifier.epage1561en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridCheng, J=14057685600en_HK
dc.identifier.scopusauthoridChung, R=7202439610en_HK
dc.identifier.scopusauthoridLam, EY=7102890004en_HK
dc.identifier.scopusauthoridFung, KSM=8627247700en_HK

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