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Article: Constructal design of particle volume fraction in nanofluids

TitleConstructal design of particle volume fraction in nanofluids
Authors
KeywordsConstructal theory
Effective thermal conductivity
Nanofluids
Overall thermal resistance
Volume fraction distribution
Issue Date2009
PublisherASME International. The Journal's web site is located at http://ojps.aip.org/ASMEJournals/HeatTransfer
Citation
Journal Of Heat Transfer, 2009, v. 131 n. 11, article no. 112402 How to Cite?
AbstractWe perform a constructal design of particle volume fraction of four types of nanofluids used for heat conduction in four systems: a circular disk, a sphere, a plane slab, and a circular annulus. The constructal volume fraction is obtained to minimize system overall temperature difference and overall thermal resistance. Also included are the features of the constructal volume fraction and the corresponding constructal thermal resistance, which is the minimal overall resistance to the heat flow. The constructal nanofluids that maximize the system performance are not necessarily the ones with uniformly dispersed particles in base fluids. Nanofluids research and development should thus focus on not only nanofluids but also systems that use them. The march toward micro- and nanoscales must also be with the sobering reminder that useful devices are always macroscopic, and that larger and larger numbers of small-scale components must be assembled and connected by flows that keep them alive. Copyright © 2009 by ASME.
Persistent Identifierhttp://hdl.handle.net/10722/59072
ISSN
2015 Impact Factor: 1.723
2015 SCImago Journal Rankings: 1.024
ISI Accession Number ID
Funding AgencyGrant Number
Research Grants Council of Hong KongGRF717508
Funding Information:

The financial support from the Research Grants Council of Hong Kong (Grant No. GRF717508) to L.W. is gratefully acknowledged

References

 

DC FieldValueLanguage
dc.contributor.authorBai, Cen_HK
dc.contributor.authorWang, Len_HK
dc.date.accessioned2010-05-31T03:42:24Z-
dc.date.available2010-05-31T03:42:24Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal Of Heat Transfer, 2009, v. 131 n. 11, article no. 112402en_HK
dc.identifier.issn0022-1481en_HK
dc.identifier.urihttp://hdl.handle.net/10722/59072-
dc.description.abstractWe perform a constructal design of particle volume fraction of four types of nanofluids used for heat conduction in four systems: a circular disk, a sphere, a plane slab, and a circular annulus. The constructal volume fraction is obtained to minimize system overall temperature difference and overall thermal resistance. Also included are the features of the constructal volume fraction and the corresponding constructal thermal resistance, which is the minimal overall resistance to the heat flow. The constructal nanofluids that maximize the system performance are not necessarily the ones with uniformly dispersed particles in base fluids. Nanofluids research and development should thus focus on not only nanofluids but also systems that use them. The march toward micro- and nanoscales must also be with the sobering reminder that useful devices are always macroscopic, and that larger and larger numbers of small-scale components must be assembled and connected by flows that keep them alive. Copyright © 2009 by ASME.en_HK
dc.languageengen_HK
dc.publisherASME International. The Journal's web site is located at http://ojps.aip.org/ASMEJournals/HeatTransferen_HK
dc.relation.ispartofJournal of Heat Transferen_HK
dc.subjectConstructal theoryen_HK
dc.subjectEffective thermal conductivityen_HK
dc.subjectNanofluidsen_HK
dc.subjectOverall thermal resistanceen_HK
dc.subjectVolume fraction distributionen_HK
dc.titleConstructal design of particle volume fraction in nanofluidsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0022-1481&volume=131&spage=112402/1&epage=112402/7&date=2009&atitle=Constructal+design+of+particle+volume+fraction+in+nanofluidsen_HK
dc.identifier.emailWang, L:lqwang@hkucc.hku.hken_HK
dc.identifier.authorityWang, L=rp00184en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1115/1.3155002en_HK
dc.identifier.scopuseid_2-s2.0-77955234404en_HK
dc.identifier.hkuros164857en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77955234404&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume131en_HK
dc.identifier.issue11en_HK
dc.identifier.spagearticle no. 112402en_HK
dc.identifier.epagearticle no. 112402en_HK
dc.identifier.isiWOS:000270403200017-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridBai, C=35232526200en_HK
dc.identifier.scopusauthoridWang, L=35235288500en_HK
dc.customcontrol.immutablecsl 140627-

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