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Article: Laser micromachining of optical microstructures with inclined sidewall profile

TitleLaser micromachining of optical microstructures with inclined sidewall profile
Authors
KeywordsConic sections
Focusing optics
Laser micro-machining
Laser-induced damage
Nanosecond ultraviolet laser
Issue Date2009
PublisherAmerican Vacuum Society. The Journal's web site is located at http://www.avs.org/literature.jvst.b.aspx
Citation
Journal Of Vacuum Science And Technology B: Microelectronics And Nanometer Structures, 2009, v. 27 n. 3, p. 1048-1052 How to Cite?
AbstractLaser micromachining has been proved to be a useful tool for the formation of microstructures in semiconductor and optical materials. It is also widely adopted for dicing of light-emitting diode chips. The authors propose a modified laser micromachining setup which enables three-dimensional structures to be formed. A mirror is inserted in the optical path between the focusing optics and the machining plane so that the beam strikes the sample at an oblique angle. By translating and/or rotating the sample as micromachining is carried out, various three-dimensional structures such as a pyramid or a conic section can be obtained. Trenches as small as 10 μm on sapphire have been realized with nanosecond ultraviolet laser pulses. Laser-induced damage, due to resolidification of the ablation melt, accumulates with increasing scans of the beam; it can be removed by chemical and mechanical treatment. © 2009 American Vacuum Society.
Persistent Identifierhttp://hdl.handle.net/10722/58802
ISSN
2015 Impact Factor: 1.398
ISI Accession Number ID
Funding AgencyGrant Number
CERGHKU 7121/06E
University Development Fund of the University of Hong Kong00600009
Funding Information:

This work was jointly supported by a CERG grant of the Research Grant Council of Hong Kong (Project No. HKU 7121/06E) and the University Development Fund of the University of Hong Kong (Nanotechnology Research Institute, Project No. 00600009)

References
Grants

 

DC FieldValueLanguage
dc.contributor.authorWang, XHen_HK
dc.contributor.authorLai, PTen_HK
dc.contributor.authorChoi, HWen_HK
dc.date.accessioned2010-05-31T03:37:10Z-
dc.date.available2010-05-31T03:37:10Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal Of Vacuum Science And Technology B: Microelectronics And Nanometer Structures, 2009, v. 27 n. 3, p. 1048-1052en_HK
dc.identifier.issn1071-1023en_HK
dc.identifier.urihttp://hdl.handle.net/10722/58802-
dc.description.abstractLaser micromachining has been proved to be a useful tool for the formation of microstructures in semiconductor and optical materials. It is also widely adopted for dicing of light-emitting diode chips. The authors propose a modified laser micromachining setup which enables three-dimensional structures to be formed. A mirror is inserted in the optical path between the focusing optics and the machining plane so that the beam strikes the sample at an oblique angle. By translating and/or rotating the sample as micromachining is carried out, various three-dimensional structures such as a pyramid or a conic section can be obtained. Trenches as small as 10 μm on sapphire have been realized with nanosecond ultraviolet laser pulses. Laser-induced damage, due to resolidification of the ablation melt, accumulates with increasing scans of the beam; it can be removed by chemical and mechanical treatment. © 2009 American Vacuum Society.en_HK
dc.languageengen_HK
dc.publisherAmerican Vacuum Society. The Journal's web site is located at http://www.avs.org/literature.jvst.b.aspxen_HK
dc.relation.ispartofJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structuresen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsJournal of Vacuum Science and Technology Part B: Microelectronics and Nanometer Structures. Copyright © American Institute of Physics.-
dc.rightsCopyright (2009) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in (Journal of Vacuum Science and Technology Part B: Microelectronics and Nanometer Structures, 2009, v. 27 n. 3, p. 1048-1052) and may be found at (http://avspublications.org/jvstb/resource/1/jvtbd9/v27/i3/p1048_s1).-
dc.subjectConic sections-
dc.subjectFocusing optics-
dc.subjectLaser micro-machining-
dc.subjectLaser-induced damage-
dc.subjectNanosecond ultraviolet laser-
dc.titleLaser micromachining of optical microstructures with inclined sidewall profileen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1071-1023&volume=27&issue=3&spage=1048&epage=1052&date=2009&atitle=Laser+micromachining+of+optical+microstructures+with+inclined+sidewall+profile-
dc.identifier.emailLai, PT:laip@eee.hku.hken_HK
dc.identifier.emailChoi, HW:hwchoi@eee.hku.hken_HK
dc.identifier.authorityLai, PT=rp00130en_HK
dc.identifier.authorityChoi, HW=rp00108en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1116/1.3117344en_HK
dc.identifier.scopuseid_2-s2.0-79651469432en_HK
dc.identifier.hkuros163475en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-79651469432&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume27en_HK
dc.identifier.issue3en_HK
dc.identifier.spage1048en_HK
dc.identifier.epage1052en_HK
dc.identifier.isiWOS:000266500300009-
dc.publisher.placeUnited Statesen_HK
dc.relation.projectMicrometer and nanometer scale GaN emissive devices at visible and ultraviolet wavelengths-
dc.identifier.scopusauthoridWang, XH=34168501000en_HK
dc.identifier.scopusauthoridLai, PT=7202946460en_HK
dc.identifier.scopusauthoridChoi, HW=7404334877en_HK

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