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Article: Laser micromachining of optical microstructures with inclined sidewall profile
Title | Laser micromachining of optical microstructures with inclined sidewall profile | ||||||
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Authors | |||||||
Keywords | Conic sections Focusing optics Laser micro-machining Laser-induced damage Nanosecond ultraviolet laser | ||||||
Issue Date | 2009 | ||||||
Publisher | American Vacuum Society. The Journal's web site is located at http://www.avs.org/literature.jvst.b.aspx | ||||||
Citation | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 2009, v. 27 n. 3, p. 1048-1052 How to Cite? | ||||||
Abstract | Laser micromachining has been proved to be a useful tool for the formation of microstructures in semiconductor and optical materials. It is also widely adopted for dicing of light-emitting diode chips. The authors propose a modified laser micromachining setup which enables three-dimensional structures to be formed. A mirror is inserted in the optical path between the focusing optics and the machining plane so that the beam strikes the sample at an oblique angle. By translating and/or rotating the sample as micromachining is carried out, various three-dimensional structures such as a pyramid or a conic section can be obtained. Trenches as small as 10 μm on sapphire have been realized with nanosecond ultraviolet laser pulses. Laser-induced damage, due to resolidification of the ablation melt, accumulates with increasing scans of the beam; it can be removed by chemical and mechanical treatment. © 2009 American Vacuum Society. | ||||||
Persistent Identifier | http://hdl.handle.net/10722/58802 | ||||||
ISSN | 2018 Impact Factor: 1.351 | ||||||
ISI Accession Number ID |
Funding Information: This work was jointly supported by a CERG grant of the Research Grant Council of Hong Kong (Project No. HKU 7121/06E) and the University Development Fund of the University of Hong Kong (Nanotechnology Research Institute, Project No. 00600009) | ||||||
References | |||||||
Grants |
DC Field | Value | Language |
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dc.contributor.author | Wang, XH | en_HK |
dc.contributor.author | Lai, PT | en_HK |
dc.contributor.author | Choi, HW | en_HK |
dc.date.accessioned | 2010-05-31T03:37:10Z | - |
dc.date.available | 2010-05-31T03:37:10Z | - |
dc.date.issued | 2009 | en_HK |
dc.identifier.citation | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 2009, v. 27 n. 3, p. 1048-1052 | - |
dc.identifier.issn | 1071-1023 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/58802 | - |
dc.description.abstract | Laser micromachining has been proved to be a useful tool for the formation of microstructures in semiconductor and optical materials. It is also widely adopted for dicing of light-emitting diode chips. The authors propose a modified laser micromachining setup which enables three-dimensional structures to be formed. A mirror is inserted in the optical path between the focusing optics and the machining plane so that the beam strikes the sample at an oblique angle. By translating and/or rotating the sample as micromachining is carried out, various three-dimensional structures such as a pyramid or a conic section can be obtained. Trenches as small as 10 μm on sapphire have been realized with nanosecond ultraviolet laser pulses. Laser-induced damage, due to resolidification of the ablation melt, accumulates with increasing scans of the beam; it can be removed by chemical and mechanical treatment. © 2009 American Vacuum Society. | en_HK |
dc.language | eng | en_HK |
dc.publisher | American Vacuum Society. The Journal's web site is located at http://www.avs.org/literature.jvst.b.aspx | en_HK |
dc.relation.ispartof | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures | en_HK |
dc.rights | Copyright 2009 American Vacuum Society. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Vacuum Society. The following article appeared in Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 2009, v. 27 n. 3, p. 1048-1052 and may be found at https://doi.org/10.1116/1.3117344 | - |
dc.subject | Conic sections | - |
dc.subject | Focusing optics | - |
dc.subject | Laser micro-machining | - |
dc.subject | Laser-induced damage | - |
dc.subject | Nanosecond ultraviolet laser | - |
dc.title | Laser micromachining of optical microstructures with inclined sidewall profile | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1071-1023&volume=27&issue=3&spage=1048&epage=1052&date=2009&atitle=Laser+micromachining+of+optical+microstructures+with+inclined+sidewall+profile | - |
dc.identifier.email | Lai, PT:laip@eee.hku.hk | en_HK |
dc.identifier.email | Choi, HW:hwchoi@eee.hku.hk | en_HK |
dc.identifier.authority | Lai, PT=rp00130 | en_HK |
dc.identifier.authority | Choi, HW=rp00108 | en_HK |
dc.description.nature | published_or_final_version | - |
dc.identifier.doi | 10.1116/1.3117344 | en_HK |
dc.identifier.scopus | eid_2-s2.0-79651469432 | en_HK |
dc.identifier.hkuros | 163475 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-79651469432&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 27 | en_HK |
dc.identifier.issue | 3 | en_HK |
dc.identifier.spage | 1048 | en_HK |
dc.identifier.epage | 1052 | en_HK |
dc.identifier.isi | WOS:000266500300009 | - |
dc.publisher.place | United States | en_HK |
dc.relation.project | Micrometer and nanometer scale GaN emissive devices at visible and ultraviolet wavelengths | - |
dc.identifier.scopusauthorid | Wang, XH=34168501000 | en_HK |
dc.identifier.scopusauthorid | Lai, PT=7202946460 | en_HK |
dc.identifier.scopusauthorid | Choi, HW=7404334877 | en_HK |
dc.identifier.issnl | 1071-1023 | - |