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Article: 3-D measurement of solder paste using two-step phase shift profilometry

Title3-D measurement of solder paste using two-step phase shift profilometry
Authors
Keywords3-D measurement
Fourier transform profilometry
Hilbert transform
Phase shift profilometry
Solder paste
Issue Date2008
PublisherIEEE.
Citation
Ieee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 4, p. 306-315 How to Cite?
AbstractA two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are π-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the four-step phase shift profilometry (4-step PSP). In Fourier transform profilometry (FTP), a bandpass filter is required to extract the fundamental spectrum from the background and higher order harmonics due to camera noise and imperfectness of the pattern projector. By using two π-out-of-phase sinusoidal fringe patterns, the background term can be eliminated directly by taking the average of the two fringe patterns. The fringe pattern which is close to its ideal form can also be recovered from the averaging process. Prefiltering is utilized in filtering raw images to remove noise causing higher order harmonics. Hilbert transform is then used to obtain the in-quadrate component of the processed fringe pattern. Postfiltering is applied for reconstructing an appropriate 3-D profile. © 2008 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/58757
ISSN
2010 Impact Factor: 0.892
2013 SCImago Journal Rankings: 0.347
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorHui, TWen_HK
dc.contributor.authorPang, GKHen_HK
dc.date.accessioned2010-05-31T03:36:22Z-
dc.date.available2010-05-31T03:36:22Z-
dc.date.issued2008en_HK
dc.identifier.citationIeee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 4, p. 306-315en_HK
dc.identifier.issn1521-334Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/58757-
dc.description.abstractA two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are π-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the four-step phase shift profilometry (4-step PSP). In Fourier transform profilometry (FTP), a bandpass filter is required to extract the fundamental spectrum from the background and higher order harmonics due to camera noise and imperfectness of the pattern projector. By using two π-out-of-phase sinusoidal fringe patterns, the background term can be eliminated directly by taking the average of the two fringe patterns. The fringe pattern which is close to its ideal form can also be recovered from the averaging process. Prefiltering is utilized in filtering raw images to remove noise causing higher order harmonics. Hilbert transform is then used to obtain the in-quadrate component of the processed fringe pattern. Postfiltering is applied for reconstructing an appropriate 3-D profile. © 2008 IEEE.en_HK
dc.languageengen_HK
dc.publisherIEEE.en_HK
dc.relation.ispartofIEEE Transactions on Electronics Packaging Manufacturingen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsIEEE Transactions on Electronics Packaging Manufacturing. Copyright © IEEE.en_HK
dc.rights©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subject3-D measurementen_HK
dc.subjectFourier transform profilometryen_HK
dc.subjectHilbert transformen_HK
dc.subjectPhase shift profilometryen_HK
dc.subjectSolder pasteen_HK
dc.title3-D measurement of solder paste using two-step phase shift profilometryen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1521-334X&volume=31&issue=4&spage=306&epage=315&date=2008&atitle=3-D+measurement+of+solder+paste+using+two-step+phase+shift+profilometryen_HK
dc.identifier.emailPang, GKH:gpang@eee.hku.hken_HK
dc.identifier.authorityPang, GKH=rp00162en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/TEPM.2008.2004573en_HK
dc.identifier.scopuseid_2-s2.0-54249153338en_HK
dc.identifier.hkuros167160en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-54249153338&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume31en_HK
dc.identifier.issue4en_HK
dc.identifier.spage306en_HK
dc.identifier.epage315en_HK
dc.identifier.isiWOS:000260332500005-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridHui, TW=23667519200en_HK
dc.identifier.scopusauthoridPang, GKH=7103393283en_HK

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