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Article: 3-D measurement of solder paste using two-step phase shift profilometry
Title | 3-D measurement of solder paste using two-step phase shift profilometry |
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Authors | |
Keywords | 3-D measurement Fourier transform profilometry Hilbert transform Phase shift profilometry Solder paste |
Issue Date | 2008 |
Publisher | IEEE. |
Citation | Ieee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 4, p. 306-315 How to Cite? |
Abstract | A two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are π-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the four-step phase shift profilometry (4-step PSP). In Fourier transform profilometry (FTP), a bandpass filter is required to extract the fundamental spectrum from the background and higher order harmonics due to camera noise and imperfectness of the pattern projector. By using two π-out-of-phase sinusoidal fringe patterns, the background term can be eliminated directly by taking the average of the two fringe patterns. The fringe pattern which is close to its ideal form can also be recovered from the averaging process. Prefiltering is utilized in filtering raw images to remove noise causing higher order harmonics. Hilbert transform is then used to obtain the in-quadrate component of the processed fringe pattern. Postfiltering is applied for reconstructing an appropriate 3-D profile. © 2008 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/58757 |
ISSN | 2010 Impact Factor: 0.892 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Hui, TW | en_HK |
dc.contributor.author | Pang, GKH | en_HK |
dc.date.accessioned | 2010-05-31T03:36:22Z | - |
dc.date.available | 2010-05-31T03:36:22Z | - |
dc.date.issued | 2008 | en_HK |
dc.identifier.citation | Ieee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 4, p. 306-315 | en_HK |
dc.identifier.issn | 1521-334X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/58757 | - |
dc.description.abstract | A two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are π-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the four-step phase shift profilometry (4-step PSP). In Fourier transform profilometry (FTP), a bandpass filter is required to extract the fundamental spectrum from the background and higher order harmonics due to camera noise and imperfectness of the pattern projector. By using two π-out-of-phase sinusoidal fringe patterns, the background term can be eliminated directly by taking the average of the two fringe patterns. The fringe pattern which is close to its ideal form can also be recovered from the averaging process. Prefiltering is utilized in filtering raw images to remove noise causing higher order harmonics. Hilbert transform is then used to obtain the in-quadrate component of the processed fringe pattern. Postfiltering is applied for reconstructing an appropriate 3-D profile. © 2008 IEEE. | en_HK |
dc.language | eng | en_HK |
dc.publisher | IEEE. | en_HK |
dc.relation.ispartof | IEEE Transactions on Electronics Packaging Manufacturing | en_HK |
dc.rights | ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | - |
dc.subject | 3-D measurement | en_HK |
dc.subject | Fourier transform profilometry | en_HK |
dc.subject | Hilbert transform | en_HK |
dc.subject | Phase shift profilometry | en_HK |
dc.subject | Solder paste | en_HK |
dc.title | 3-D measurement of solder paste using two-step phase shift profilometry | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1521-334X&volume=31&issue=4&spage=306&epage=315&date=2008&atitle=3-D+measurement+of+solder+paste+using+two-step+phase+shift+profilometry | en_HK |
dc.identifier.email | Pang, GKH:gpang@eee.hku.hk | en_HK |
dc.identifier.authority | Pang, GKH=rp00162 | en_HK |
dc.description.nature | published_or_final_version | - |
dc.identifier.doi | 10.1109/TEPM.2008.2004573 | en_HK |
dc.identifier.scopus | eid_2-s2.0-54249153338 | en_HK |
dc.identifier.hkuros | 167160 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-54249153338&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 31 | en_HK |
dc.identifier.issue | 4 | en_HK |
dc.identifier.spage | 306 | en_HK |
dc.identifier.epage | 315 | en_HK |
dc.identifier.isi | WOS:000260332500005 | - |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Hui, TW=23667519200 | en_HK |
dc.identifier.scopusauthorid | Pang, GKH=7103393283 | en_HK |
dc.identifier.issnl | 1521-334X | - |