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Article: Effect of temperature on water sorption and solubility of dental adhesive resins

TitleEffect of temperature on water sorption and solubility of dental adhesive resins
Authors
KeywordsDental adhesives
Resin
Solubility
Temperature
Water sorption
Issue Date2009
PublisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jdent
Citation
Journal Of Dentistry, 2009, v. 37 n. 2, p. 122-132 How to Cite?
AbstractObjective: This study examined the effect of temperature on water sorption and solubility characteristics of four commercial dental adhesives. The null hypothesis tested was that temperature has no effect on the water sorption and solubility characteristics of these adhesives. Methods: The tested materials were: three-step etch-and-rinse (All-Bond 2, AB), two-step etch-and-rinse (One-Step, OS), two-step self-etch (Clearfil SE Bond, SE) and one-step self-etch (Clearfil S3 Bond, S3) adhesives. Seven resin disks (6 mm in diameter × 1 mm in thickness) were prepared from each tested material and were stored in deionized water at 23 °C, 37 °C and 55 °C. Water sorption and solubility of the resin disks were measured before and after water immersion and desiccation following two consecutive sorption and desorption cycles. The water sorption and solubility values obtained were analyzed using two-way ANOVA and Tukey's multiple comparison tests. The relationships between maximum water sorption, solubility and kinetics of water diffusion with temperature were evaluated by means of Pearson correlation statistic. Results: OS exhibited the highest water sorption and solubility values in the second sorption-desorption cycle at 55 °C (p < 0.001). This is followed by S3, SE and AB with no significant difference between SE and AB. Significant positive correlations were observed between maximum water sorption (r = 0.307, p < 0.01), solubility (r = 0.244, p < 0.05), water sorption (r = 0.651, p < 0.001) and desorption (r = 0.733, p < 0.001) diffusion coefficients (obtained using Fick's law of diffusion) with temperature in the second cycle. Significance: High temperatures increased water sorption of simplified adhesives. Such water sorption may contribute to the failure of resin-dentin bonds. © 2008 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/58058
ISSN
2015 Impact Factor: 3.109
2015 SCImago Journal Rankings: 1.029
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorDhanpal, Pen_HK
dc.contributor.authorYiu, CKYen_HK
dc.contributor.authorKing, NMen_HK
dc.contributor.authorTay, FRen_HK
dc.contributor.authorHiraishi, Nen_HK
dc.date.accessioned2010-05-31T03:23:05Z-
dc.date.available2010-05-31T03:23:05Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal Of Dentistry, 2009, v. 37 n. 2, p. 122-132en_HK
dc.identifier.issn0300-5712en_HK
dc.identifier.urihttp://hdl.handle.net/10722/58058-
dc.description.abstractObjective: This study examined the effect of temperature on water sorption and solubility characteristics of four commercial dental adhesives. The null hypothesis tested was that temperature has no effect on the water sorption and solubility characteristics of these adhesives. Methods: The tested materials were: three-step etch-and-rinse (All-Bond 2, AB), two-step etch-and-rinse (One-Step, OS), two-step self-etch (Clearfil SE Bond, SE) and one-step self-etch (Clearfil S3 Bond, S3) adhesives. Seven resin disks (6 mm in diameter × 1 mm in thickness) were prepared from each tested material and were stored in deionized water at 23 °C, 37 °C and 55 °C. Water sorption and solubility of the resin disks were measured before and after water immersion and desiccation following two consecutive sorption and desorption cycles. The water sorption and solubility values obtained were analyzed using two-way ANOVA and Tukey's multiple comparison tests. The relationships between maximum water sorption, solubility and kinetics of water diffusion with temperature were evaluated by means of Pearson correlation statistic. Results: OS exhibited the highest water sorption and solubility values in the second sorption-desorption cycle at 55 °C (p < 0.001). This is followed by S3, SE and AB with no significant difference between SE and AB. Significant positive correlations were observed between maximum water sorption (r = 0.307, p < 0.01), solubility (r = 0.244, p < 0.05), water sorption (r = 0.651, p < 0.001) and desorption (r = 0.733, p < 0.001) diffusion coefficients (obtained using Fick's law of diffusion) with temperature in the second cycle. Significance: High temperatures increased water sorption of simplified adhesives. Such water sorption may contribute to the failure of resin-dentin bonds. © 2008 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jdenten_HK
dc.relation.ispartofJournal of Dentistryen_HK
dc.rightsJournal of Dentistry. Copyright © Elsevier Ltd.en_HK
dc.subjectDental adhesivesen_HK
dc.subjectResinen_HK
dc.subjectSolubilityen_HK
dc.subjectTemperatureen_HK
dc.subjectWater sorptionen_HK
dc.subject.meshAbsorptionen_HK
dc.subject.meshAdsorptionen_HK
dc.subject.meshDentin-Bonding Agents - chemistryen_HK
dc.subject.meshDesiccationen_HK
dc.subject.meshDiffusionen_HK
dc.subject.meshHumansen_HK
dc.subject.meshHumidityen_HK
dc.subject.meshImmersionen_HK
dc.subject.meshMaterials Testingen_HK
dc.subject.meshMethacrylates - chemistryen_HK
dc.subject.meshModels, Chemicalen_HK
dc.subject.meshResin Cements - chemistryen_HK
dc.subject.meshSolubilityen_HK
dc.subject.meshSurface Propertiesen_HK
dc.subject.meshTemperatureen_HK
dc.subject.meshTime Factorsen_HK
dc.subject.meshWater - chemistryen_HK
dc.titleEffect of temperature on water sorption and solubility of dental adhesive resinsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0300-5712&volume=37&spage=122&epage=132&date=2009&atitle=Effect+of+temperature+on+water+sorption+and+solubility+of+dental+adhesive+resins.+en_HK
dc.identifier.emailYiu, CKY: ckyyiu@hkucc.hku.hken_HK
dc.identifier.emailKing, NM: hhdbknm@hkucc.hku.hken_HK
dc.identifier.authorityYiu, CKY=rp00018en_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.jdent.2008.10.004en_HK
dc.identifier.pmid19062151-
dc.identifier.scopuseid_2-s2.0-58149161673en_HK
dc.identifier.hkuros154474en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-58149161673&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume37en_HK
dc.identifier.issue2en_HK
dc.identifier.spage122en_HK
dc.identifier.epage132en_HK
dc.identifier.isiWOS:000262923200006-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridDhanpal, P=25723169100en_HK
dc.identifier.scopusauthoridYiu, CKY=7007115156en_HK
dc.identifier.scopusauthoridKing, NM=7201762850en_HK
dc.identifier.scopusauthoridTay, FR=7102091962en_HK
dc.identifier.scopusauthoridHiraishi, N=8925934400en_HK

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