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Article: Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction

TitleStructured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction
Authors
Keywords3-D reconstruction
Binary pattern projection
Fringe boundary detection
Ronchi pattern
Specular surface
Wafer bump
Issue Date2008
PublisherIEEE.
Citation
Ieee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 1, p. 19-31 How to Cite?
AbstractAdvanced electronic manufacturing requires the 3-D inspection of very small surfaces like the solder bumps on wafers for direct die-to-die bonding. Yet the microscopic size and highly specular and textureless nature of the surfaces make the task difficult. It is also demanded that the size of the entire inspection system be small so as to minimize restraint on the operation of the various moving parts involved in the manufacturing process. In this paper, we describe a new 3-D reconstruction mechanism for the task. The mechanism is based upon the well-known concept of structured-light projection, but adapted to a new configuration that owns a particularly small system size and operates in a different manner. Unlike the traditional mechanisms which involve an array of light sources that occupy a rather extended physical space, the proposed mechanism consists of only a single light source plus a binary grating for projecting binary pattern. To allow the projection at each position of the inspected surface to vary and form distinct binary code, the binary grating is shifted in space. In every shift, a separate image of the illuminated surface is taken. With the use of pattern projection, and of discrete coding instead of analog coding in the projection, issues like texture-absence, image saturation, and image noise of the inspected surfaces are much lessened. Experimental results on a variety of objects are presented to illustrate the effectiveness of this mechanism. © 2008 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/57481
ISSN
2010 Impact Factor: 0.892
2013 SCImago Journal Rankings: 0.347
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorCheng, Jen_HK
dc.contributor.authorChung, CKRen_HK
dc.contributor.authorLam, EYen_HK
dc.contributor.authorFung, KSMen_HK
dc.contributor.authorWang, Fen_HK
dc.contributor.authorLeung, WHen_HK
dc.date.accessioned2010-04-12T01:37:42Z-
dc.date.available2010-04-12T01:37:42Z-
dc.date.issued2008en_HK
dc.identifier.citationIeee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 1, p. 19-31en_HK
dc.identifier.issn1521-334Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/57481-
dc.description.abstractAdvanced electronic manufacturing requires the 3-D inspection of very small surfaces like the solder bumps on wafers for direct die-to-die bonding. Yet the microscopic size and highly specular and textureless nature of the surfaces make the task difficult. It is also demanded that the size of the entire inspection system be small so as to minimize restraint on the operation of the various moving parts involved in the manufacturing process. In this paper, we describe a new 3-D reconstruction mechanism for the task. The mechanism is based upon the well-known concept of structured-light projection, but adapted to a new configuration that owns a particularly small system size and operates in a different manner. Unlike the traditional mechanisms which involve an array of light sources that occupy a rather extended physical space, the proposed mechanism consists of only a single light source plus a binary grating for projecting binary pattern. To allow the projection at each position of the inspected surface to vary and form distinct binary code, the binary grating is shifted in space. In every shift, a separate image of the illuminated surface is taken. With the use of pattern projection, and of discrete coding instead of analog coding in the projection, issues like texture-absence, image saturation, and image noise of the inspected surfaces are much lessened. Experimental results on a variety of objects are presented to illustrate the effectiveness of this mechanism. © 2008 IEEE.en_HK
dc.languageengen_HK
dc.publisherIEEE.en_HK
dc.relation.ispartofIEEE Transactions on Electronics Packaging Manufacturingen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rights©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_HK
dc.subject3-D reconstructionen_HK
dc.subjectBinary pattern projectionen_HK
dc.subjectFringe boundary detectionen_HK
dc.subjectRonchi patternen_HK
dc.subjectSpecular surfaceen_HK
dc.subjectWafer bumpen_HK
dc.titleStructured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstructionen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1521-334X&volume=31&issue=1&spage=19&epage=31&date=2008&atitle=Structure-light+based+sensing+using+a+single+fixed+fringe+grating:+fringe+boundary+detection+and+3-D+reconstructionen_HK
dc.identifier.emailLam, EY:elam@eee.hku.hken_HK
dc.identifier.authorityLam, EY=rp00131en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1109/TEPM.2007.914209en_HK
dc.identifier.scopuseid_2-s2.0-39449127618en_HK
dc.identifier.hkuros143601-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-39449127618&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume31en_HK
dc.identifier.issue1en_HK
dc.identifier.spage19en_HK
dc.identifier.epage31en_HK
dc.identifier.isiWOS:000252338300003-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridCheng, J=14057685600en_HK
dc.identifier.scopusauthoridChung, CKR=14524013400en_HK
dc.identifier.scopusauthoridLam, EY=7102890004en_HK
dc.identifier.scopusauthoridFung, KSM=8627247700en_HK
dc.identifier.scopusauthoridWang, F=7501312203en_HK
dc.identifier.scopusauthoridLeung, WH=36956842400en_HK

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