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Article: Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction
Title | Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction |
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Authors | |
Keywords | 3-D reconstruction Binary pattern projection Fringe boundary detection Ronchi pattern Specular surface Wafer bump |
Issue Date | 2008 |
Publisher | IEEE. |
Citation | Ieee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 1, p. 19-31 How to Cite? |
Abstract | Advanced electronic manufacturing requires the 3-D inspection of very small surfaces like the solder bumps on wafers for direct die-to-die bonding. Yet the microscopic size and highly specular and textureless nature of the surfaces make the task difficult. It is also demanded that the size of the entire inspection system be small so as to minimize restraint on the operation of the various moving parts involved in the manufacturing process. In this paper, we describe a new 3-D reconstruction mechanism for the task. The mechanism is based upon the well-known concept of structured-light projection, but adapted to a new configuration that owns a particularly small system size and operates in a different manner. Unlike the traditional mechanisms which involve an array of light sources that occupy a rather extended physical space, the proposed mechanism consists of only a single light source plus a binary grating for projecting binary pattern. To allow the projection at each position of the inspected surface to vary and form distinct binary code, the binary grating is shifted in space. In every shift, a separate image of the illuminated surface is taken. With the use of pattern projection, and of discrete coding instead of analog coding in the projection, issues like texture-absence, image saturation, and image noise of the inspected surfaces are much lessened. Experimental results on a variety of objects are presented to illustrate the effectiveness of this mechanism. © 2008 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/57481 |
ISSN | 2010 Impact Factor: 0.892 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cheng, J | en_HK |
dc.contributor.author | Chung, CKR | en_HK |
dc.contributor.author | Lam, EY | en_HK |
dc.contributor.author | Fung, KSM | en_HK |
dc.contributor.author | Wang, F | en_HK |
dc.contributor.author | Leung, WH | en_HK |
dc.date.accessioned | 2010-04-12T01:37:42Z | - |
dc.date.available | 2010-04-12T01:37:42Z | - |
dc.date.issued | 2008 | en_HK |
dc.identifier.citation | Ieee Transactions On Electronics Packaging Manufacturing, 2008, v. 31 n. 1, p. 19-31 | en_HK |
dc.identifier.issn | 1521-334X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/57481 | - |
dc.description.abstract | Advanced electronic manufacturing requires the 3-D inspection of very small surfaces like the solder bumps on wafers for direct die-to-die bonding. Yet the microscopic size and highly specular and textureless nature of the surfaces make the task difficult. It is also demanded that the size of the entire inspection system be small so as to minimize restraint on the operation of the various moving parts involved in the manufacturing process. In this paper, we describe a new 3-D reconstruction mechanism for the task. The mechanism is based upon the well-known concept of structured-light projection, but adapted to a new configuration that owns a particularly small system size and operates in a different manner. Unlike the traditional mechanisms which involve an array of light sources that occupy a rather extended physical space, the proposed mechanism consists of only a single light source plus a binary grating for projecting binary pattern. To allow the projection at each position of the inspected surface to vary and form distinct binary code, the binary grating is shifted in space. In every shift, a separate image of the illuminated surface is taken. With the use of pattern projection, and of discrete coding instead of analog coding in the projection, issues like texture-absence, image saturation, and image noise of the inspected surfaces are much lessened. Experimental results on a variety of objects are presented to illustrate the effectiveness of this mechanism. © 2008 IEEE. | en_HK |
dc.language | eng | en_HK |
dc.publisher | IEEE. | en_HK |
dc.relation.ispartof | IEEE Transactions on Electronics Packaging Manufacturing | en_HK |
dc.rights | ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | - |
dc.subject | 3-D reconstruction | en_HK |
dc.subject | Binary pattern projection | en_HK |
dc.subject | Fringe boundary detection | en_HK |
dc.subject | Ronchi pattern | en_HK |
dc.subject | Specular surface | en_HK |
dc.subject | Wafer bump | en_HK |
dc.title | Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1521-334X&volume=31&issue=1&spage=19&epage=31&date=2008&atitle=Structure-light+based+sensing+using+a+single+fixed+fringe+grating:+fringe+boundary+detection+and+3-D+reconstruction | en_HK |
dc.identifier.email | Lam, EY:elam@eee.hku.hk | en_HK |
dc.identifier.authority | Lam, EY=rp00131 | en_HK |
dc.description.nature | published_or_final_version | en_HK |
dc.identifier.doi | 10.1109/TEPM.2007.914209 | en_HK |
dc.identifier.scopus | eid_2-s2.0-39449127618 | en_HK |
dc.identifier.hkuros | 143601 | - |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-39449127618&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 31 | en_HK |
dc.identifier.issue | 1 | en_HK |
dc.identifier.spage | 19 | en_HK |
dc.identifier.epage | 31 | en_HK |
dc.identifier.isi | WOS:000252338300003 | - |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Cheng, J=14057685600 | en_HK |
dc.identifier.scopusauthorid | Chung, CKR=14524013400 | en_HK |
dc.identifier.scopusauthorid | Lam, EY=7102890004 | en_HK |
dc.identifier.scopusauthorid | Fung, KSM=8627247700 | en_HK |
dc.identifier.scopusauthorid | Wang, F=7501312203 | en_HK |
dc.identifier.scopusauthorid | Leung, WH=36956842400 | en_HK |
dc.identifier.issnl | 1521-334X | - |