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postgraduate thesis: Solder paste inspection and 3D shape estimation using directional LED lightings

TitleSolder paste inspection and 3D shape estimation using directional LED lightings
Authors
Advisors
Advisor(s):Pang, GKH
Issue Date2007
PublisherThe University of Hong Kong (Pokfulam, Hong Kong)
Citation
Chu, M. [朱銘熙]. (2007). Solder paste inspection and 3D shape estimation using directional LED lightings. (Thesis). University of Hong Kong, Pokfulam, Hong Kong SAR. Retrieved from http://dx.doi.org/10.5353/th_b3963417
DegreeMaster of Philosophy
SubjectSolder pastes - Testing.
Surface mount technology.
Dept/ProgramElectrical and Electronic Engineering
Persistent Identifierhttp://hdl.handle.net/10722/51552
HKU Library Item IDb3963417

 

DC FieldValueLanguage
dc.contributor.advisorPang, GKH-
dc.contributor.authorChu, Ming-hei.-
dc.contributor.author朱銘熙.-
dc.date.issued2007-
dc.identifier.citationChu, M. [朱銘熙]. (2007). Solder paste inspection and 3D shape estimation using directional LED lightings. (Thesis). University of Hong Kong, Pokfulam, Hong Kong SAR. Retrieved from http://dx.doi.org/10.5353/th_b3963417-
dc.identifier.urihttp://hdl.handle.net/10722/51552-
dc.languageeng-
dc.publisherThe University of Hong Kong (Pokfulam, Hong Kong)-
dc.relation.ispartofHKU Theses Online (HKUTO)-
dc.rightsThe author retains all proprietary rights, (such as patent rights) and the right to use in future works.-
dc.rightsThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.-
dc.source.urihttp://hub.hku.hk/bib/B39634176-
dc.subject.lcshSolder pastes - Testing.-
dc.subject.lcshSurface mount technology.-
dc.titleSolder paste inspection and 3D shape estimation using directional LED lightings-
dc.typePG_Thesis-
dc.identifier.hkulb3963417-
dc.description.thesisnameMaster of Philosophy-
dc.description.thesislevelMaster-
dc.description.thesisdisciplineElectrical and Electronic Engineering-
dc.description.naturepublished_or_final_version-
dc.description.natureabstract-
dc.identifier.doi10.5353/th_b3963417-
dc.date.hkucongregation2008-
dc.identifier.mmsid991022803449703414-

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