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Conference Paper: Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

TitleThree-dimensional reconstruction of wafer solder bumps using binary pattern projection
Authors
KeywordsBinary Pattern Projection
Codeword
Ronchi Pattern
Specular surface
Three-Dimensional Reconstruction
Wafer Bump
Issue Date2005
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Citation
Proceedings Of Spie - The International Society For Optical Engineering, 2005, v. 5679, p. 44-52 How to Cite?
AbstractAs the electronic industry advances rapidly, the shrunk dimension of the device leads to more stringent requirement on process control and quality assurance. For instance, the tiny size of the solder bumps grown on wafers for direct die-to-die bonding pose great challenge to the inspection of the bumps' 3D quality. Traditional pattern projection method of recovering 3D is about projecting a light pattern to the inspected surface and imaging the illuminated surface from one or more points of view. However, image saturation and the specular nature of the bump surface are issues. This paper proposes a new 3D reconstruction mechanism for inspecting the surface of such wafer bumps. It is still based upon the light pattern projection framework, but uses the Ronchi pattern - a pattern that contrasts with the traditionally used gray level one. With the use of a parallel or point light source in combination with a binary grating, it allows a discrete pattern to be projected onto the inspected surface. As the projected pattern is binary, the image information is binary as well. With such a bright-or-dark world for each image position, the above-mentioned difficult issues are avoided. Preliminary study shows that the mechanism holds promises that existing approaches do not. © 2005 SPIE and IS&T.
Persistent Identifierhttp://hdl.handle.net/10722/45762
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorCheng, Jen_HK
dc.contributor.authorChung, Ren_HK
dc.contributor.authorLam, EYen_HK
dc.contributor.authorFung, KSMen_HK
dc.contributor.authorWang, Fen_HK
dc.contributor.authorLeung, WHen_HK
dc.date.accessioned2007-10-30T06:34:53Z-
dc.date.available2007-10-30T06:34:53Z-
dc.date.issued2005en_HK
dc.identifier.citationProceedings Of Spie - The International Society For Optical Engineering, 2005, v. 5679, p. 44-52en_HK
dc.identifier.issn0277-786Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/45762-
dc.description.abstractAs the electronic industry advances rapidly, the shrunk dimension of the device leads to more stringent requirement on process control and quality assurance. For instance, the tiny size of the solder bumps grown on wafers for direct die-to-die bonding pose great challenge to the inspection of the bumps' 3D quality. Traditional pattern projection method of recovering 3D is about projecting a light pattern to the inspected surface and imaging the illuminated surface from one or more points of view. However, image saturation and the specular nature of the bump surface are issues. This paper proposes a new 3D reconstruction mechanism for inspecting the surface of such wafer bumps. It is still based upon the light pattern projection framework, but uses the Ronchi pattern - a pattern that contrasts with the traditionally used gray level one. With the use of a parallel or point light source in combination with a binary grating, it allows a discrete pattern to be projected onto the inspected surface. As the projected pattern is binary, the image information is binary as well. With such a bright-or-dark world for each image position, the above-mentioned difficult issues are avoided. Preliminary study shows that the mechanism holds promises that existing approaches do not. © 2005 SPIE and IS&T.en_HK
dc.format.extent513859 bytes-
dc.format.extent4084 bytes-
dc.format.mimetypeapplication/pdf-
dc.format.mimetypetext/plain-
dc.languageengen_HK
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xmlen_HK
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_HK
dc.rightsS P I E - the International Society for Optical Proceedings. Copyright © S P I E - International Society for Optical Engineering.en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsCopyright 2005 Society of Photo-Optical Instrumentation Engineers. This paper was published in Machine Vision Applications in Industrial Inspection XIII, San Jose, California, USA, 17-18 January 2005, v. 5679, p. 44-52 and is made available as an electronic reprint with permission of SPIE. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.en_HK
dc.subjectBinary Pattern Projectionen_HK
dc.subjectCodeworden_HK
dc.subjectRonchi Patternen_HK
dc.subjectSpecular surfaceen_HK
dc.subjectThree-Dimensional Reconstructionen_HK
dc.subjectWafer Bumpen_HK
dc.titleThree-dimensional reconstruction of wafer solder bumps using binary pattern projectionen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0277-786X&volume=5679&spage=44&epage=52&date=2005&atitle=Three-dimensional+reconstruction+of+wafer+solder+bumps+using+binary+pattern+projectionen_HK
dc.identifier.emailLam, EY:elam@eee.hku.hken_HK
dc.identifier.authorityLam, EY=rp00131en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1117/12.586628en_HK
dc.identifier.scopuseid_2-s2.0-21844458198en_HK
dc.identifier.hkuros101041-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-21844458198&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume5679en_HK
dc.identifier.spage44en_HK
dc.identifier.epage52en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridCheng, J=14057685600en_HK
dc.identifier.scopusauthoridChung, R=7202439610en_HK
dc.identifier.scopusauthoridLam, EY=7102890004en_HK
dc.identifier.scopusauthoridFung, KSM=8627247700en_HK
dc.identifier.scopusauthoridWang, F=7501312203en_HK
dc.identifier.scopusauthoridLeung, WH=36956842400en_HK

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