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Conference Paper: Reference-free detection of semiconductor assembly defect

TitleReference-free detection of semiconductor assembly defect
Authors
KeywordsDefect detection
Feature detection
Image analysis
Semiconductor assembly process
Issue Date2005
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Citation
Proceedings Of Spie - The International Society For Optical Engineering, 2005, v. 5679, p. 27-35 How to Cite?
AbstractThis paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection. The integrated circuit (IC) pattern is usually periodic and regular. Therefore, we can implement a classification scheme whereby the regular pattern in the die image is classified as the acceptable circuit pattern and the die defect can be modeled as irregularity on the image. The detection of irregularity in image is thus equivalent to the detection of die defect. We propose a method where the defect detection algorithm first segments the die image into different regions according to the circuit pattern by a set of morphological segmentations with different structuring element sizes. Then, a feature vector, which consists of many image attributes, is calculated for each segmented region. Lastly, the defective region is extracted by the feature vector classification. © 2005 SPIE and IS&T.
Persistent Identifierhttp://hdl.handle.net/10722/45761
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorNg, ANYen_HK
dc.contributor.authorLam, EYen_HK
dc.contributor.authorChung, Ren_HK
dc.contributor.authorFung, KSMen_HK
dc.contributor.authorLeung, WHen_HK
dc.date.accessioned2007-10-30T06:34:52Z-
dc.date.available2007-10-30T06:34:52Z-
dc.date.issued2005en_HK
dc.identifier.citationProceedings Of Spie - The International Society For Optical Engineering, 2005, v. 5679, p. 27-35en_HK
dc.identifier.issn0277-786Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/45761-
dc.description.abstractThis paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection. The integrated circuit (IC) pattern is usually periodic and regular. Therefore, we can implement a classification scheme whereby the regular pattern in the die image is classified as the acceptable circuit pattern and the die defect can be modeled as irregularity on the image. The detection of irregularity in image is thus equivalent to the detection of die defect. We propose a method where the defect detection algorithm first segments the die image into different regions according to the circuit pattern by a set of morphological segmentations with different structuring element sizes. Then, a feature vector, which consists of many image attributes, is calculated for each segmented region. Lastly, the defective region is extracted by the feature vector classification. © 2005 SPIE and IS&T.en_HK
dc.format.extent240190 bytes-
dc.format.extent4084 bytes-
dc.format.mimetypeapplication/pdf-
dc.format.mimetypetext/plain-
dc.languageengen_HK
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xmlen_HK
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsS P I E - the International Society for Optical Proceedings. Copyright © S P I E - International Society for Optical Engineering.en_HK
dc.rightsCopyright 2005 Society of Photo-Optical Instrumentation Engineers. This paper was published in Machine Vision Applications in Industrial Inspection XIII, San Jose, California, USA, 17-18 January 2005, v. 5679, p. 27-35 and is made available as an electronic reprint with permission of SPIE. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.en_HK
dc.subjectDefect detectionen_HK
dc.subjectFeature detectionen_HK
dc.subjectImage analysisen_HK
dc.subjectSemiconductor assembly processen_HK
dc.titleReference-free detection of semiconductor assembly defecten_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0277-786X&volume=5679&spage=27&epage=35&date=2005&atitle=Reference-free+detection+of+semiconductor+assembly+defecten_HK
dc.identifier.emailLam, EY:elam@eee.hku.hken_HK
dc.identifier.authorityLam, EY=rp00131en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1117/12.584883en_HK
dc.identifier.scopuseid_2-s2.0-21844452182en_HK
dc.identifier.hkuros101040-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-21844452182&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume5679en_HK
dc.identifier.spage27en_HK
dc.identifier.epage35en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridNg, ANY=8627247900en_HK
dc.identifier.scopusauthoridLam, EY=7102890004en_HK
dc.identifier.scopusauthoridChung, R=7202439610en_HK
dc.identifier.scopusauthoridFung, KSM=8627247700en_HK
dc.identifier.scopusauthoridLeung, WH=36956842400en_HK

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