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Conference Paper: Reference-free detection of semiconductor assembly defect
Title | Reference-free detection of semiconductor assembly defect |
---|---|
Authors | |
Keywords | Defect detection Feature detection Image analysis Semiconductor assembly process |
Issue Date | 2005 |
Publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml |
Citation | Proceedings Of Spie - The International Society For Optical Engineering, 2005, v. 5679, p. 27-35 How to Cite? |
Abstract | This paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection. The integrated circuit (IC) pattern is usually periodic and regular. Therefore, we can implement a classification scheme whereby the regular pattern in the die image is classified as the acceptable circuit pattern and the die defect can be modeled as irregularity on the image. The detection of irregularity in image is thus equivalent to the detection of die defect. We propose a method where the defect detection algorithm first segments the die image into different regions according to the circuit pattern by a set of morphological segmentations with different structuring element sizes. Then, a feature vector, which consists of many image attributes, is calculated for each segmented region. Lastly, the defective region is extracted by the feature vector classification. © 2005 SPIE and IS&T. |
Persistent Identifier | http://hdl.handle.net/10722/45761 |
ISSN | 2023 SCImago Journal Rankings: 0.152 |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ng, ANY | en_HK |
dc.contributor.author | Lam, EY | en_HK |
dc.contributor.author | Chung, R | en_HK |
dc.contributor.author | Fung, KSM | en_HK |
dc.contributor.author | Leung, WH | en_HK |
dc.date.accessioned | 2007-10-30T06:34:52Z | - |
dc.date.available | 2007-10-30T06:34:52Z | - |
dc.date.issued | 2005 | en_HK |
dc.identifier.citation | Proceedings Of Spie - The International Society For Optical Engineering, 2005, v. 5679, p. 27-35 | en_HK |
dc.identifier.issn | 0277-786X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/45761 | - |
dc.description.abstract | This paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection. The integrated circuit (IC) pattern is usually periodic and regular. Therefore, we can implement a classification scheme whereby the regular pattern in the die image is classified as the acceptable circuit pattern and the die defect can be modeled as irregularity on the image. The detection of irregularity in image is thus equivalent to the detection of die defect. We propose a method where the defect detection algorithm first segments the die image into different regions according to the circuit pattern by a set of morphological segmentations with different structuring element sizes. Then, a feature vector, which consists of many image attributes, is calculated for each segmented region. Lastly, the defective region is extracted by the feature vector classification. © 2005 SPIE and IS&T. | en_HK |
dc.format.extent | 240190 bytes | - |
dc.format.extent | 4084 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.format.mimetype | text/plain | - |
dc.language | eng | en_HK |
dc.publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml | en_HK |
dc.relation.ispartof | Proceedings of SPIE - The International Society for Optical Engineering | en_HK |
dc.rights | Copyright 2005 Society of Photo‑Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this publication for a fee or for commercial purposes, and modification of the contents of the publication are prohibited. This article is available online at https://doi.org/10.1117/12.584883 | - |
dc.subject | Defect detection | en_HK |
dc.subject | Feature detection | en_HK |
dc.subject | Image analysis | en_HK |
dc.subject | Semiconductor assembly process | en_HK |
dc.title | Reference-free detection of semiconductor assembly defect | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0277-786X&volume=5679&spage=27&epage=35&date=2005&atitle=Reference-free+detection+of+semiconductor+assembly+defect | en_HK |
dc.identifier.email | Lam, EY:elam@eee.hku.hk | en_HK |
dc.identifier.authority | Lam, EY=rp00131 | en_HK |
dc.description.nature | published_or_final_version | en_HK |
dc.identifier.doi | 10.1117/12.584883 | en_HK |
dc.identifier.scopus | eid_2-s2.0-21844452182 | en_HK |
dc.identifier.hkuros | 101040 | - |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-21844452182&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 5679 | en_HK |
dc.identifier.spage | 27 | en_HK |
dc.identifier.epage | 35 | en_HK |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Ng, ANY=8627247900 | en_HK |
dc.identifier.scopusauthorid | Lam, EY=7102890004 | en_HK |
dc.identifier.scopusauthorid | Chung, R=7202439610 | en_HK |
dc.identifier.scopusauthorid | Fung, KSM=8627247700 | en_HK |
dc.identifier.scopusauthorid | Leung, WH=36956842400 | en_HK |
dc.identifier.issnl | 0277-786X | - |