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Article: Standard cell design with resolution-enhancement-technique-driven regularly placed contacts and gates
Title | Standard cell design with resolution-enhancement-technique-driven regularly placed contacts and gates |
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Authors | |
Keywords | Circuit performance Design and process integration Low-k 1, lithography Multiple exposures Regularly placed layout Resolution enhancement technologies Standard cells Template lithography |
Issue Date | 2005 |
Publisher | S P I E - International Society for Optical Engineering. |
Citation | Journal Of Microlithography, Microfabrication, And Microsystems, 2005, v. 4 n. 1, article no. 013001, p. 1-10 How to Cite? |
Abstract | The practicability and methodology of applying resolution-enhancement- technique-driven regularly placed contacts and gates on standard cell layout design are studied. The regular placement enables more effective use of resolution enhancement techniques (RETs), which in turn enables a reduction of critical dimensions. Although regular placement of contacts and gates adds restrictions during cell layout, the over-all circuit area can be made smaller and the number of extra masks and exposures can be kept to the lowest by careful selection of the grid pitch, using template-trim chromeless phase-shifting lithography approaches, enabling unrestricted contact placement in one direction, and using rectangular rather than square contacts. Four different fabrication-friendly layouts are compared. The average area change of 64 standard cells in a 130-nm library range from -4.2 to -15.8% with the four fabricationfriendly layout approaches. The area change of five test circuits using the four approaches range from -16.2 to +2.6%. Dynamic power consumption and intrinsic delay also improve with the decrease in circuits area, which is verified with the examination results. © 2005 Society of Pnoto-Optical Instrumentation Engineers. |
Persistent Identifier | http://hdl.handle.net/10722/44719 |
ISSN | |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Wang, J | en_HK |
dc.contributor.author | Wong, AK | en_HK |
dc.contributor.author | Lam, EY | en_HK |
dc.date.accessioned | 2007-10-30T06:08:41Z | - |
dc.date.available | 2007-10-30T06:08:41Z | - |
dc.date.issued | 2005 | en_HK |
dc.identifier.citation | Journal Of Microlithography, Microfabrication, And Microsystems, 2005, v. 4 n. 1, article no. 013001, p. 1-10 | en_HK |
dc.identifier.issn | 1537-1646 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/44719 | - |
dc.description.abstract | The practicability and methodology of applying resolution-enhancement- technique-driven regularly placed contacts and gates on standard cell layout design are studied. The regular placement enables more effective use of resolution enhancement techniques (RETs), which in turn enables a reduction of critical dimensions. Although regular placement of contacts and gates adds restrictions during cell layout, the over-all circuit area can be made smaller and the number of extra masks and exposures can be kept to the lowest by careful selection of the grid pitch, using template-trim chromeless phase-shifting lithography approaches, enabling unrestricted contact placement in one direction, and using rectangular rather than square contacts. Four different fabrication-friendly layouts are compared. The average area change of 64 standard cells in a 130-nm library range from -4.2 to -15.8% with the four fabricationfriendly layout approaches. The area change of five test circuits using the four approaches range from -16.2 to +2.6%. Dynamic power consumption and intrinsic delay also improve with the decrease in circuits area, which is verified with the examination results. © 2005 Society of Pnoto-Optical Instrumentation Engineers. | en_HK |
dc.format.extent | 846412 bytes | - |
dc.format.extent | 4084 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.format.mimetype | text/plain | - |
dc.language | eng | en_HK |
dc.publisher | S P I E - International Society for Optical Engineering. | en_HK |
dc.relation.ispartof | Journal of Microlithography, Microfabrication, and Microsystems | en_HK |
dc.rights | Copyright 2005 Society of Photo‑Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this publication for a fee or for commercial purposes, and modification of the contents of the publication are prohibited. This article is available online at https://doi.org/10.1117/1.1857529 | - |
dc.subject | Circuit performance | en_HK |
dc.subject | Design and process integration | en_HK |
dc.subject | Low-k 1, lithography | en_HK |
dc.subject | Multiple exposures | en_HK |
dc.subject | Regularly placed layout | en_HK |
dc.subject | Resolution enhancement technologies | en_HK |
dc.subject | Standard cells | en_HK |
dc.subject | Template lithography | en_HK |
dc.title | Standard cell design with resolution-enhancement-technique-driven regularly placed contacts and gates | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Lam, EY:elam@eee.hku.hk | en_HK |
dc.identifier.authority | Lam, EY=rp00131 | en_HK |
dc.description.nature | published_or_final_version | en_HK |
dc.identifier.doi | 10.1117/1.1857529 | en_HK |
dc.identifier.scopus | eid_2-s2.0-24144489825 | en_HK |
dc.identifier.hkuros | 101036 | - |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-24144489825&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 4 | en_HK |
dc.identifier.issue | 1 | en_HK |
dc.identifier.spage | article no. 013001, p. 1 | en_HK |
dc.identifier.epage | article no. 013001, p. 10 | en_HK |
dc.identifier.isi | WOS:000232841700007 | - |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Wang, J=8716933500 | en_HK |
dc.identifier.scopusauthorid | Wong, AK=7403147663 | en_HK |
dc.identifier.scopusauthorid | Lam, EY=7102890004 | en_HK |
dc.identifier.issnl | 1537-1646 | - |