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Article: Microstructural study in heteroepitaxial YBa/sub 2/Cu/sub 3/O/sub 7//Nd/sub 2/CuO/sub 4/ multi-layers by using electron microscopy

TitleMicrostructural study in heteroepitaxial YBa/sub 2/Cu/sub 3/O/sub 7//Nd/sub 2/CuO/sub 4/ multi-layers by using electron microscopy
Authors
Issue Date2003
PublisherIEEE.
Citation
IEEE Transactions on Applied Superconductivity, 2003, v. 13 n. 2 pt 1, p. 885-888 How to Cite?
AbstractNeodymium copper oxide Nd/sub 2/CuO/sub 4/ (NCO) has been applied as a buffer material to improve the epitaxy of YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) thin films on reactive substrates and as a potential barrier to construct multi-layer junctions. The microstructures and interfaces in heteroepitaxial Nd/sub 2/CuO/sub 4//YBCO multi-layer have been characterized by using an electron microscopy. Cross-sectional images obtained on a transmission electron microscopy (TEM) revealed an atomically sharp boundary between layers, underlining the excellent compatibility of NCO with YBCO. No chemical reaction occurred between film and substrate. It was found that all layers grow highly epitaxially with their c-axis perpendicular to the substrate surface. On the other hand, various defects such as mis-oriented grains and stacking faults were found near the interfaces.
Persistent Identifierhttp://hdl.handle.net/10722/43391
ISSN
2015 Impact Factor: 1.092
2015 SCImago Journal Rankings: 0.381
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorGao, Jen_HK
dc.contributor.authorCheung, YLen_HK
dc.contributor.authorSo, SMen_HK
dc.date.accessioned2007-03-23T04:44:49Z-
dc.date.available2007-03-23T04:44:49Z-
dc.date.issued2003en_HK
dc.identifier.citationIEEE Transactions on Applied Superconductivity, 2003, v. 13 n. 2 pt 1, p. 885-888en_HK
dc.identifier.issn1051-8223en_HK
dc.identifier.urihttp://hdl.handle.net/10722/43391-
dc.description.abstractNeodymium copper oxide Nd/sub 2/CuO/sub 4/ (NCO) has been applied as a buffer material to improve the epitaxy of YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) thin films on reactive substrates and as a potential barrier to construct multi-layer junctions. The microstructures and interfaces in heteroepitaxial Nd/sub 2/CuO/sub 4//YBCO multi-layer have been characterized by using an electron microscopy. Cross-sectional images obtained on a transmission electron microscopy (TEM) revealed an atomically sharp boundary between layers, underlining the excellent compatibility of NCO with YBCO. No chemical reaction occurred between film and substrate. It was found that all layers grow highly epitaxially with their c-axis perpendicular to the substrate surface. On the other hand, various defects such as mis-oriented grains and stacking faults were found near the interfaces.en_HK
dc.format.extent911199 bytes-
dc.format.extent30720 bytes-
dc.format.mimetypeapplication/pdf-
dc.format.mimetypeapplication/msword-
dc.languageengen_HK
dc.publisherIEEE.en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rights©2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_HK
dc.titleMicrostructural study in heteroepitaxial YBa/sub 2/Cu/sub 3/O/sub 7//Nd/sub 2/CuO/sub 4/ multi-layers by using electron microscopyen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1051-8223&volume=13&issue=2 pt 1&spage=885&epage=888&date=2003&atitle=Microstructural+study+in+heteroepitaxial+YBa/sub+2/Cu/sub+3/O/sub+7//Nd/sub+2/CuO/sub+4/+multi-layers+by+using+electron+microscopyen_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1109/TASC.2003.814059en_HK
dc.identifier.scopuseid_2-s2.0-0042441090-
dc.identifier.hkuros80022-
dc.identifier.isiWOS:000184241700201-

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