File Download
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1109/TASC.2003.814059
- Scopus: eid_2-s2.0-0042441090
- WOS: WOS:000184241700201
- Find via
Supplementary
- Citations:
- Appears in Collections:
Article: Microstructural study in heteroepitaxial YBa/sub 2/Cu/sub 3/O/sub 7//Nd/sub 2/CuO/sub 4/ multi-layers by using electron microscopy
| Title | Microstructural study in heteroepitaxial YBa/sub 2/Cu/sub 3/O/sub 7//Nd/sub 2/CuO/sub 4/ multi-layers by using electron microscopy |
|---|---|
| Authors | |
| Keywords | Nd2CuO4 Superconducting films TEM |
| Issue Date | 2003 |
| Publisher | IEEE. |
| Citation | IEEE Transactions on Applied Superconductivity, 2003, v. 13 n. 2 pt 1, p. 885-888 How to Cite? |
| Abstract | Neodymium copper oxide Nd/sub 2/CuO/sub 4/ (NCO) has been applied as a buffer material to improve the epitaxy of YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) thin films on reactive substrates and as a potential barrier to construct multi-layer junctions. The microstructures and interfaces in heteroepitaxial Nd/sub 2/CuO/sub 4//YBCO multi-layer have been characterized by using an electron microscopy. Cross-sectional images obtained on a transmission electron microscopy (TEM) revealed an atomically sharp boundary between layers, underlining the excellent compatibility of NCO with YBCO. No chemical reaction occurred between film and substrate. It was found that all layers grow highly epitaxially with their c-axis perpendicular to the substrate surface. On the other hand, various defects such as mis-oriented grains and stacking faults were found near the interfaces. |
| Persistent Identifier | http://hdl.handle.net/10722/43391 |
| ISSN | 2023 Impact Factor: 1.7 2023 SCImago Journal Rankings: 0.500 |
| ISI Accession Number ID |
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Gao, J | en_HK |
| dc.contributor.author | Cheung, YL | en_HK |
| dc.contributor.author | So, SM | en_HK |
| dc.date.accessioned | 2007-03-23T04:44:49Z | - |
| dc.date.available | 2007-03-23T04:44:49Z | - |
| dc.date.issued | 2003 | en_HK |
| dc.identifier.citation | IEEE Transactions on Applied Superconductivity, 2003, v. 13 n. 2 pt 1, p. 885-888 | en_HK |
| dc.identifier.issn | 1051-8223 | en_HK |
| dc.identifier.uri | http://hdl.handle.net/10722/43391 | - |
| dc.description.abstract | Neodymium copper oxide Nd/sub 2/CuO/sub 4/ (NCO) has been applied as a buffer material to improve the epitaxy of YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) thin films on reactive substrates and as a potential barrier to construct multi-layer junctions. The microstructures and interfaces in heteroepitaxial Nd/sub 2/CuO/sub 4//YBCO multi-layer have been characterized by using an electron microscopy. Cross-sectional images obtained on a transmission electron microscopy (TEM) revealed an atomically sharp boundary between layers, underlining the excellent compatibility of NCO with YBCO. No chemical reaction occurred between film and substrate. It was found that all layers grow highly epitaxially with their c-axis perpendicular to the substrate surface. On the other hand, various defects such as mis-oriented grains and stacking faults were found near the interfaces. | en_HK |
| dc.format.extent | 911199 bytes | - |
| dc.format.extent | 30720 bytes | - |
| dc.format.mimetype | application/pdf | - |
| dc.format.mimetype | application/msword | - |
| dc.language | eng | en_HK |
| dc.publisher | IEEE. | en_HK |
| dc.relation.ispartof | IEEE Transactions on Applied Superconductivity | - |
| dc.rights | ©2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | - |
| dc.subject | Nd2CuO4 | - |
| dc.subject | Superconducting films | - |
| dc.subject | TEM | - |
| dc.title | Microstructural study in heteroepitaxial YBa/sub 2/Cu/sub 3/O/sub 7//Nd/sub 2/CuO/sub 4/ multi-layers by using electron microscopy | en_HK |
| dc.type | Article | en_HK |
| dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1051-8223&volume=13&issue=2 pt 1&spage=885&epage=888&date=2003&atitle=Microstructural+study+in+heteroepitaxial+YBa/sub+2/Cu/sub+3/O/sub+7//Nd/sub+2/CuO/sub+4/+multi-layers+by+using+electron+microscopy | en_HK |
| dc.description.nature | published_or_final_version | en_HK |
| dc.identifier.doi | 10.1109/TASC.2003.814059 | en_HK |
| dc.identifier.scopus | eid_2-s2.0-0042441090 | - |
| dc.identifier.hkuros | 80022 | - |
| dc.identifier.isi | WOS:000184241700201 | - |
| dc.identifier.issnl | 1051-8223 | - |