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Article: Size effects of nanoindentation creep

TitleSize effects of nanoindentation creep
Authors
KeywordsEngineering
Engineering mechanics and materials physics
Issue Date2004
PublisherMaterials Research Society. The Journal's web site is located at http://www.mrs.org/publications/jmr
Citation
Journal Of Materials Research, 2004, v. 19 n. 2, p. 513-522 How to Cite?
AbstractThe size effects on indentation creep were studied on single-crystal Ni3Al, polycrystalline pure Al, and fused quartz samples at room temperature. The stress exponents were measured by monitoring the displacement during constant indentation loads after correction for thermal drift effects. The stress exponents were found to exhibit a very strong size effect. In the two metals Al and Ni3Al, the stress exponent for very small indents is very small, and for Al, this even approaches unity, suggesting that linear diffusional flow may be the controlling mechanism. The stress exponents in these two metals rise rapidly to over 100 as the indent size gets larger, indicating a rapid change of the dominating mechanism to climb-controlled to eventually glide-controlled events. In fused quartz, the stress exponent also exhibits a sharply rising trend as the indent size increases. The stress exponent is also close to unity at the smallest indents studied, and it rises rapidly to a few tens as the indent size gets larger.
Persistent Identifierhttp://hdl.handle.net/10722/43058
ISSN
2015 Impact Factor: 1.579
2015 SCImago Journal Rankings: 0.664
References

 

DC FieldValueLanguage
dc.contributor.authorLi, Hen_HK
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2007-03-23T04:37:50Z-
dc.date.available2007-03-23T04:37:50Z-
dc.date.issued2004en_HK
dc.identifier.citationJournal Of Materials Research, 2004, v. 19 n. 2, p. 513-522en_HK
dc.identifier.issn0884-2914en_HK
dc.identifier.urihttp://hdl.handle.net/10722/43058-
dc.description.abstractThe size effects on indentation creep were studied on single-crystal Ni3Al, polycrystalline pure Al, and fused quartz samples at room temperature. The stress exponents were measured by monitoring the displacement during constant indentation loads after correction for thermal drift effects. The stress exponents were found to exhibit a very strong size effect. In the two metals Al and Ni3Al, the stress exponent for very small indents is very small, and for Al, this even approaches unity, suggesting that linear diffusional flow may be the controlling mechanism. The stress exponents in these two metals rise rapidly to over 100 as the indent size gets larger, indicating a rapid change of the dominating mechanism to climb-controlled to eventually glide-controlled events. In fused quartz, the stress exponent also exhibits a sharply rising trend as the indent size increases. The stress exponent is also close to unity at the smallest indents studied, and it rises rapidly to a few tens as the indent size gets larger.en_HK
dc.format.extent5936290 bytes-
dc.format.extent40924 bytes-
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dc.languageengen_HK
dc.publisherMaterials Research Society. The Journal's web site is located at http://www.mrs.org/publications/jmren_HK
dc.relation.ispartofJournal of Materials Researchen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsJournal of Materials Research. Copyright © Materials Research Society.en_HK
dc.subjectEngineeringen_HK
dc.subjectEngineering mechanics and materials physicsen_HK
dc.titleSize effects of nanoindentation creepen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0884-2914&volume=19&issue=2&spage=513&epage=522&date=2004&atitle=Size+effects+of+nanoindentation+creepen_HK
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1557/JMR.2004.0063en_HK
dc.identifier.scopuseid_2-s2.0-1842715169en_HK
dc.identifier.hkuros88669-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-1842715169&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume19en_HK
dc.identifier.issue2en_HK
dc.identifier.spage513en_HK
dc.identifier.epage522en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridLi, H=26432017800en_HK
dc.identifier.scopusauthoridNgan, AHW=7006827202en_HK

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