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Article: Investigation of slip transmission behavior across grain boundaries in polycrystalline Ni3Al using nanoindentation

TitleInvestigation of slip transmission behavior across grain boundaries in polycrystalline Ni3Al using nanoindentation
Authors
KeywordsEngineering
Engineering mechanics and materials physics
Issue Date2004
PublisherMaterials Research Society. The Journal's web site is located at http://www.mrs.org/publications/jmr
Citation
Journal Of Materials Research, 2004, v. 19 n. 1, p. 189-201 How to Cite?
AbstractThe influence of grain boundaries on material deformation in Ni3Al was investigated by relating the material pile-up at grain boundaries and the propagation of slip across grain boundaries to the misorientation between the corresponding grains. Indentation tests were carried out using micro- and nanoindentation at distances shorter than the radius of indent size from a grain boundary on Ni3Al. The indents were observed using scanning electron microscopy and non-contact-mode atomic force microscopy. Repeated experimentation did not reveal a rising trend of hardness near grain boundaries, indicating that hardness is not a sensitive parameter to measure grain boundary strengthening effects. However, it was observed that the slip transfer behavior across a grain boundary has a strong dependence on a local misorientation factor m′ relating the misorientation of slip planes and slip directions on either side of the grain boundary. This result agrees with the fundamental assumption in the physical explanation of the Hall-Petch effect. © 2004 Materials Research Society.
Persistent Identifierhttp://hdl.handle.net/10722/43055
ISSN
2015 Impact Factor: 1.579
2015 SCImago Journal Rankings: 0.664
References

 

DC FieldValueLanguage
dc.contributor.authorWo, PCen_HK
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2007-03-23T04:37:46Z-
dc.date.available2007-03-23T04:37:46Z-
dc.date.issued2004en_HK
dc.identifier.citationJournal Of Materials Research, 2004, v. 19 n. 1, p. 189-201en_HK
dc.identifier.issn0884-2914en_HK
dc.identifier.urihttp://hdl.handle.net/10722/43055-
dc.description.abstractThe influence of grain boundaries on material deformation in Ni3Al was investigated by relating the material pile-up at grain boundaries and the propagation of slip across grain boundaries to the misorientation between the corresponding grains. Indentation tests were carried out using micro- and nanoindentation at distances shorter than the radius of indent size from a grain boundary on Ni3Al. The indents were observed using scanning electron microscopy and non-contact-mode atomic force microscopy. Repeated experimentation did not reveal a rising trend of hardness near grain boundaries, indicating that hardness is not a sensitive parameter to measure grain boundary strengthening effects. However, it was observed that the slip transfer behavior across a grain boundary has a strong dependence on a local misorientation factor m′ relating the misorientation of slip planes and slip directions on either side of the grain boundary. This result agrees with the fundamental assumption in the physical explanation of the Hall-Petch effect. © 2004 Materials Research Society.en_HK
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dc.languageengen_HK
dc.publisherMaterials Research Society. The Journal's web site is located at http://www.mrs.org/publications/jmren_HK
dc.relation.ispartofJournal of Materials Researchen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsJournal of Materials Research. Copyright © Materials Research Society.en_HK
dc.subjectEngineeringen_HK
dc.subjectEngineering mechanics and materials physicsen_HK
dc.titleInvestigation of slip transmission behavior across grain boundaries in polycrystalline Ni3Al using nanoindentationen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0884-2914&volume=19&issue=1&spage=189&epage=201&date=2004&atitle=Investigation+of+slip+transmission+behavior+across+grain+boundaries+in+polycrystalline+Ni3Al+using+nanoindentationen_HK
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1557/JMR.2004.0023en_HK
dc.identifier.scopuseid_2-s2.0-4444230402en_HK
dc.identifier.hkuros88661-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-4444230402&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume19en_HK
dc.identifier.issue1en_HK
dc.identifier.spage189en_HK
dc.identifier.epage201en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridWo, PC=9433530200en_HK
dc.identifier.scopusauthoridNgan, AHW=7006827202en_HK

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