File Download
  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Effects of creep and thermal drift on modulus measurement using depth-sensing indentation

TitleEffects of creep and thermal drift on modulus measurement using depth-sensing indentation
Authors
KeywordsEngineering
Engineering mechanics and materials physics
Issue Date2002
PublisherMaterials Research Society. The Journal's web site is located at http://www.mrs.org/publications/jmr
Citation
Journal Of Materials Research, 2002, v. 17 n. 3, p. 660-668 How to Cite?
AbstractIn modulus measurement by depth-sensing indentation, previous considerations assume elastic recovery to be the sole process during unloading, but in reality creep and thermal drift may also occur, causing serious errors in the measured modulus. In this work, the problem of indentation on a linear viscoelastic half-space is solved using the correspondence principle between elasticity and linear viscoelasticity. The correction term due to creep in the apparent contact compliance is found to be equal to the ratio of the indenter displacement rate at the end of the load hold to the unloading rate. A condition for nullifying the effect of thermal drift on modulus measurement is also proposed. With this condition satisfied, the effect of thermal drift on the calculated modulus is negligible irrespective of the magnitude of the drift rate.
Persistent Identifierhttp://hdl.handle.net/10722/43037
ISSN
2015 Impact Factor: 1.579
2015 SCImago Journal Rankings: 0.664
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorFeng, Gen_HK
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2007-03-23T04:37:23Z-
dc.date.available2007-03-23T04:37:23Z-
dc.date.issued2002en_HK
dc.identifier.citationJournal Of Materials Research, 2002, v. 17 n. 3, p. 660-668en_HK
dc.identifier.issn0884-2914en_HK
dc.identifier.urihttp://hdl.handle.net/10722/43037-
dc.description.abstractIn modulus measurement by depth-sensing indentation, previous considerations assume elastic recovery to be the sole process during unloading, but in reality creep and thermal drift may also occur, causing serious errors in the measured modulus. In this work, the problem of indentation on a linear viscoelastic half-space is solved using the correspondence principle between elasticity and linear viscoelasticity. The correction term due to creep in the apparent contact compliance is found to be equal to the ratio of the indenter displacement rate at the end of the load hold to the unloading rate. A condition for nullifying the effect of thermal drift on modulus measurement is also proposed. With this condition satisfied, the effect of thermal drift on the calculated modulus is negligible irrespective of the magnitude of the drift rate.en_HK
dc.format.extent333802 bytes-
dc.format.extent40924 bytes-
dc.format.extent310 bytes-
dc.format.mimetypeapplication/pdf-
dc.format.mimetypeapplication/pdf-
dc.format.mimetypetext/plain-
dc.languageengen_HK
dc.publisherMaterials Research Society. The Journal's web site is located at http://www.mrs.org/publications/jmren_HK
dc.relation.ispartofJournal of Materials Researchen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsJournal of Materials Research. Copyright © Materials Research Society.en_HK
dc.subjectEngineeringen_HK
dc.subjectEngineering mechanics and materials physicsen_HK
dc.titleEffects of creep and thermal drift on modulus measurement using depth-sensing indentationen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0884-2914&volume=17&issue=3&spage=660&epage=668&date=2002&atitle=Effects+of+creep+and+thermal+drift+on+modulus+measurement+using+depth-sensing+indentationen_HK
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1557/JMR.2002.0094en_HK
dc.identifier.scopuseid_2-s2.0-0036507302en_HK
dc.identifier.hkuros67026-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0036507302&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume17en_HK
dc.identifier.issue3en_HK
dc.identifier.spage660en_HK
dc.identifier.epage668en_HK
dc.identifier.isiWOS:000174300000024-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridFeng, G=7401641884en_HK
dc.identifier.scopusauthoridNgan, AHW=7006827202en_HK

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats