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Article: Special modulator for high frequency, low-voltage plasma immersion ion implantation
Title | Special modulator for high frequency, low-voltage plasma immersion ion implantation |
---|---|
Authors | |
Keywords | Instruments |
Issue Date | 1999 |
Publisher | American Institute of Physics. The Journal's web site is located at http://ojps.aip.org/rsio/ |
Citation | Review of Scientific Instruments, 1999, v. 70 n. 3, p. 1824-1828 How to Cite? |
Abstract | Plasma immersion ion implantation is a burgeoning surface modification technique and not limited by the line-of-sight restriction plaguing conventional beam-line ion implantation. It is therefore an excellent technique to treat interior surfaces as well as components of a complex shape. To enhance the implant uniformity and increase the thickness of the modified layer, we are using a high frequency, low-voltage process to achieve high temperature and dose rate to increase the thickness of the modified layer. The low voltage conditions also lead to a thinner sheath more favorable to conformal implantation. In this article, we will describe our special modulator consisting of a single ended forward converter with a step-up transformer. The modulator is designed to operate from 5 to 35 kHz and the output voltage is adjustable to an upper ceiling of 5000 V that is deliberately chosen to be our voltage limit for the present experiments. We will also present experimental data on SS304 stainless steel materials elucidating the advantages of our modulator and high frequency, low-voltage experimental protocols. ©1999 American Institute of Physics. |
Persistent Identifier | http://hdl.handle.net/10722/42788 |
ISSN | 2023 Impact Factor: 1.3 2023 SCImago Journal Rankings: 0.434 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Tian, X | en_HK |
dc.contributor.author | Wang, X | en_HK |
dc.contributor.author | Tang, B | en_HK |
dc.contributor.author | Chu, PK | en_HK |
dc.contributor.author | Ko, PK | en_HK |
dc.contributor.author | Cheng, YC | en_HK |
dc.date.accessioned | 2007-03-23T04:32:12Z | - |
dc.date.available | 2007-03-23T04:32:12Z | - |
dc.date.issued | 1999 | en_HK |
dc.identifier.citation | Review of Scientific Instruments, 1999, v. 70 n. 3, p. 1824-1828 | - |
dc.identifier.issn | 0034-6748 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/42788 | - |
dc.description.abstract | Plasma immersion ion implantation is a burgeoning surface modification technique and not limited by the line-of-sight restriction plaguing conventional beam-line ion implantation. It is therefore an excellent technique to treat interior surfaces as well as components of a complex shape. To enhance the implant uniformity and increase the thickness of the modified layer, we are using a high frequency, low-voltage process to achieve high temperature and dose rate to increase the thickness of the modified layer. The low voltage conditions also lead to a thinner sheath more favorable to conformal implantation. In this article, we will describe our special modulator consisting of a single ended forward converter with a step-up transformer. The modulator is designed to operate from 5 to 35 kHz and the output voltage is adjustable to an upper ceiling of 5000 V that is deliberately chosen to be our voltage limit for the present experiments. We will also present experimental data on SS304 stainless steel materials elucidating the advantages of our modulator and high frequency, low-voltage experimental protocols. ©1999 American Institute of Physics. | en_HK |
dc.format.extent | 81296 bytes | - |
dc.format.extent | 27136 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.format.mimetype | application/msword | - |
dc.language | eng | en_HK |
dc.publisher | American Institute of Physics. The Journal's web site is located at http://ojps.aip.org/rsio/ | en_HK |
dc.relation.ispartof | Review of Scientific Instruments | - |
dc.rights | Copyright 1999 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Review of Scientific Instruments, 1999, v. 70 n. 3, p. 1824-1828 and may be found at https://doi.org/10.1063/1.1149675 | - |
dc.subject | Instruments | en_HK |
dc.title | Special modulator for high frequency, low-voltage plasma immersion ion implantation | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0034-6748&volume=70&issue=3&spage=1824&epage=1828&date=1999&atitle=Special+modulator+for+high+frequency,+low-voltage+plasma+immersion+ion+implantation | en_HK |
dc.description.nature | published_or_final_version | en_HK |
dc.identifier.doi | 10.1063/1.1149675 | en_HK |
dc.identifier.scopus | eid_2-s2.0-0001138086 | - |
dc.identifier.hkuros | 40693 | - |
dc.identifier.volume | 70 | - |
dc.identifier.issue | 3 | - |
dc.identifier.spage | 1824 | - |
dc.identifier.epage | 1828 | - |
dc.identifier.isi | WOS:000079012100041 | - |
dc.identifier.issnl | 0034-6748 | - |