Effect of solution treatment on dislocation density in NiTi thin films

Abstract

The NiTi thin films were sputter-deposited on Cu foil. The thin films subjected to solution treatment at 800°C for 30 min; 45 min; 60 min and 120 min. X-ray diffraction profile Fourier analysis have been used to study the variation of the dislocation density and the dislocation distribution parameters during solution treatment. It has been found that the average dislocation density decreases and the coherent domain size gradually increases with the increase of solution treating time. The average dislocation distribution parameters are unchanged as the average dislocation density decreases. Microhardness was calculated from the dislocation data. The results show that the microhardness values are not in a good agreement between calculated values and measured values.