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postgraduate thesis: Pattern recognition for automated die bonding

TitlePattern recognition for automated die bonding
Authors
Issue Date1982
PublisherThe University of Hong Kong (Pokfulam, Hong Kong)
Citation
Tsang, C. [曾昭明]. (1982). Pattern recognition for automated die bonding. (Thesis). University of Hong Kong, Pokfulam, Hong Kong SAR. Retrieved from http://dx.doi.org/10.5353/th_b3120644
DegreeMaster of Philosophy
SubjectLight emitting diodes.
Sealing (Technology)
Pattern recognition systems.
Dept/ProgramElectrical Engineering

 

DC FieldValueLanguage
dc.contributor.authorTsang, Chiu-ming.-
dc.contributor.author曾昭明-
dc.date.issued1982-
dc.identifier.citationTsang, C. [曾昭明]. (1982). Pattern recognition for automated die bonding. (Thesis). University of Hong Kong, Pokfulam, Hong Kong SAR. Retrieved from http://dx.doi.org/10.5353/th_b3120644-
dc.languageeng-
dc.publisherThe University of Hong Kong (Pokfulam, Hong Kong)-
dc.relation.ispartofHKU Theses Online (HKUTO)-
dc.rightsThe author retains all proprietary rights, (such as patent rights) and the right to use in future works.-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.source.urihttp://hub.hku.hk/bib/B3120644X-
dc.subject.lcshLight emitting diodes.-
dc.subject.lcshSealing (Technology)-
dc.subject.lcshPattern recognition systems.-
dc.titlePattern recognition for automated die bonding-
dc.typePG_Thesis-
dc.identifier.hkulb3120644-
dc.description.thesisnameMaster of Philosophy-
dc.description.thesislevelMaster-
dc.description.thesisdisciplineElectrical Engineering-
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.5353/th_b3120644-
dc.date.hkucongregation1983-

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