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- Publisher Website: 10.1023/B:NANO.0000023232.03654.40
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Article: Manufacturing at nanoscale: Top-down, bottom-up and system engineering
Title | Manufacturing at nanoscale: Top-down, bottom-up and system engineering |
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Authors | |
Keywords | Hybrid top-down and bottom-up process Ultra-molding and imprinting System engineering Plasmonic imaging lithography Nanoscale Manufacturing |
Issue Date | 2004 |
Citation | Journal of Nanoparticle Research, 2004, v. 6, n. 1, p. 125-130 How to Cite? |
Abstract | The current nano-technology revolution is facing several major challenges: to manufacture nanodevices below 20 nm, to fabricate three-dimensional complex nano-structures, and to heterogeneously integrate multiple functionalities. To tackle these grand challenges, the Center for Scalable and Integrated NAno-Manufacturing (SINAM), a NSF Nanoscale Science and Engineering Center, set its goal to establish a new manufacturing paradigm that integrates an array of new nano-manufacturing technologies, including the plasmonic imaging lithography and ultramolding imprint lithography aiming toward critical resolution of 1-10 nm and the hybrid top-down and bottom-up technologies to achieve massively parallel integration of heterogeneous nanoscale components into higher-order structures and devices. Furthermore, SINAM will develop system engineering strategies to scale-up the nano-manufacturing technologies. SINAMs integrated research and education platform will shed light to a broad range of potential applications in computing, telecommunication, photonics, biotechnology, health care, and national security. |
Persistent Identifier | http://hdl.handle.net/10722/256899 |
ISSN | 2023 Impact Factor: 2.1 2023 SCImago Journal Rankings: 0.416 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Zhang, Xiang | - |
dc.contributor.author | Sun, Cheng | - |
dc.contributor.author | Fang, Nicholas | - |
dc.date.accessioned | 2018-07-24T08:58:16Z | - |
dc.date.available | 2018-07-24T08:58:16Z | - |
dc.date.issued | 2004 | - |
dc.identifier.citation | Journal of Nanoparticle Research, 2004, v. 6, n. 1, p. 125-130 | - |
dc.identifier.issn | 1388-0764 | - |
dc.identifier.uri | http://hdl.handle.net/10722/256899 | - |
dc.description.abstract | The current nano-technology revolution is facing several major challenges: to manufacture nanodevices below 20 nm, to fabricate three-dimensional complex nano-structures, and to heterogeneously integrate multiple functionalities. To tackle these grand challenges, the Center for Scalable and Integrated NAno-Manufacturing (SINAM), a NSF Nanoscale Science and Engineering Center, set its goal to establish a new manufacturing paradigm that integrates an array of new nano-manufacturing technologies, including the plasmonic imaging lithography and ultramolding imprint lithography aiming toward critical resolution of 1-10 nm and the hybrid top-down and bottom-up technologies to achieve massively parallel integration of heterogeneous nanoscale components into higher-order structures and devices. Furthermore, SINAM will develop system engineering strategies to scale-up the nano-manufacturing technologies. SINAMs integrated research and education platform will shed light to a broad range of potential applications in computing, telecommunication, photonics, biotechnology, health care, and national security. | - |
dc.language | eng | - |
dc.relation.ispartof | Journal of Nanoparticle Research | - |
dc.subject | Hybrid top-down and bottom-up process | - |
dc.subject | Ultra-molding and imprinting | - |
dc.subject | System engineering | - |
dc.subject | Plasmonic imaging lithography | - |
dc.subject | Nanoscale | - |
dc.subject | Manufacturing | - |
dc.title | Manufacturing at nanoscale: Top-down, bottom-up and system engineering | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1023/B:NANO.0000023232.03654.40 | - |
dc.identifier.scopus | eid_2-s2.0-1842658928 | - |
dc.identifier.volume | 6 | - |
dc.identifier.issue | 1 | - |
dc.identifier.spage | 125 | - |
dc.identifier.epage | 130 | - |
dc.identifier.isi | WOS:000220733200014 | - |
dc.identifier.issnl | 1388-0764 | - |