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Article: Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds

TitleThermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds
Authors
Issue Date2017
PublisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jmps
Citation
Journal of the Mechanics and Physics of Solids, 2017, v. 101, p. 197-208 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/248421
ISSN
2017 Impact Factor: 3.566
2015 SCImago Journal Rankings: 2.529
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorQian, J-
dc.contributor.authorLin, J-
dc.contributor.authorXu, G-K-
dc.contributor.authorLin, Y-
dc.contributor.authorGao, H-
dc.date.accessioned2017-10-18T08:42:56Z-
dc.date.available2017-10-18T08:42:56Z-
dc.date.issued2017-
dc.identifier.citationJournal of the Mechanics and Physics of Solids, 2017, v. 101, p. 197-208-
dc.identifier.issn0022-5096-
dc.identifier.urihttp://hdl.handle.net/10722/248421-
dc.languageeng-
dc.publisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jmps-
dc.relation.ispartofJournal of the Mechanics and Physics of Solids-
dc.rightsPosting accepted manuscript (postprint): © <year>. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/-
dc.titleThermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds-
dc.typeArticle-
dc.identifier.emailLin, Y: ylin@hkucc.hku.hk-
dc.identifier.authorityLin, Y=rp00080-
dc.identifier.doi10.1016/j.jmps.2017.01.007-
dc.identifier.hkuros280630-
dc.identifier.volume101-
dc.identifier.spage197-
dc.identifier.epage208-
dc.identifier.isiWOS:000398751200013-
dc.publisher.placeUnited Kingdom-

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