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Conference Paper: Multi-physics Co-simulations and Their Applications

TitleMulti-physics Co-simulations and Their Applications
Authors
Jiang, L
Issue Date2012
Citation
2012 IEEE Electronic Design of Advanced Packaging and Systems Symposium (EDAPS 2012), Taipei, Taiwan, 9-11 December 2012 How to Cite?
DescriptionSession E: Electromagnetic Compatibility (EMC) - E-3 Electromagnetic Emissions from the IC Packaging
Persistent Identifierhttp://hdl.handle.net/10722/240479

 

DC FieldValueLanguage
dc.contributor.authorJiang, L-
dc.date.accessioned2017-04-27T00:42:56Z-
dc.date.available2017-04-27T00:42:56Z-
dc.date.issued2012-
dc.identifier.citation2012 IEEE Electronic Design of Advanced Packaging and Systems Symposium (EDAPS 2012), Taipei, Taiwan, 9-11 December 2012-
dc.identifier.urihttp://hdl.handle.net/10722/240479-
dc.descriptionSession E: Electromagnetic Compatibility (EMC) - E-3 Electromagnetic Emissions from the IC Packaging-
dc.languageeng-
dc.relation.ispartofIEEE Electronic Design of Advanced Packaging and Systems Symposium (EDAPS)-
dc.titleMulti-physics Co-simulations and Their Applications-
dc.typeConference_Paper-
dc.identifier.emailJiang, L: jianglj@hku.hk-
dc.identifier.authorityJiang, L=rp01338-
dc.identifier.hkuros218874-

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