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Conference Paper: Electrospun bicomponent scaffolds with osteoconductivity and osteoinductivity

TitleElectrospun bicomponent scaffolds with osteoconductivity and osteoinductivity
具有骨传导性和骨引导性的双组分电纺支架：rhBMP-2 的可控缓释与支架的生物学评价
Authors
Wang, CWang, M
Issue Date2013
Citation
The 2013 Academic Meeting of the Chinese Society for Biomaterials (CSBM), Shenzhen, China, 20-23 December 2013, 1pp. How to Cite?
Description第35 场 - 专题S35：组织工程与再生材料-3 (ID: 1070)
Persistent Identifierhttp://hdl.handle.net/10722/204204

 

DC FieldValueLanguage
dc.contributor.authorWang, C-
dc.contributor.authorWang, M-
dc.date.accessioned2014-09-19T21:23:45Z-
dc.date.available2014-09-19T21:23:45Z-
dc.date.issued2013-
dc.identifier.citationThe 2013 Academic Meeting of the Chinese Society for Biomaterials (CSBM), Shenzhen, China, 20-23 December 2013, 1pp.-
dc.identifier.urihttp://hdl.handle.net/10722/204204-
dc.description第35 场 - 专题S35：组织工程与再生材料-3 (ID: 1070)-
dc.languagechi-
dc.relation.ispartofProceedings of the CSBM Academic Meeting 2013-
dc.relation.ispartof中国生物材料学会2013年大会论文集-
dc.titleElectrospun bicomponent scaffolds with osteoconductivity and osteoinductivity-
dc.title具有骨传导性和骨引导性的双组分电纺支架：rhBMP-2 的可控缓释与支架的生物学评价-
dc.typeConference_Paper-
dc.identifier.emailWang, C: adamcw@hku.hk-
dc.identifier.emailWang, M: memwang@hku.hk-
dc.identifier.authorityWang, M=rp00185-
dc.identifier.hkuros235497-

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