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- Publisher Website: 10.1016/j.wasman.2013.07.001
- Scopus: eid_2-s2.0-84900542540
- WOS: WOS:000337208600018
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Article: Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials
Title | Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials |
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Authors | |
Keywords | Ceramic materials Electroplating sludge Leaching Rietveld refinement Waterworks sludge |
Issue Date | 2014 |
Citation | Waste Management, 2014, v. 34, p. 1085-1091 How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/202690 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | TANG, Y | en_US |
dc.contributor.author | Chan, S-W | en_US |
dc.contributor.author | Shih, K | en_US |
dc.date.accessioned | 2014-09-19T09:14:17Z | - |
dc.date.available | 2014-09-19T09:14:17Z | - |
dc.date.issued | 2014 | en_US |
dc.identifier.citation | Waste Management, 2014, v. 34, p. 1085-1091 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/202690 | - |
dc.language | eng | en_US |
dc.relation.ispartof | Waste Management | en_US |
dc.subject | Ceramic materials | - |
dc.subject | Electroplating sludge | - |
dc.subject | Leaching | - |
dc.subject | Rietveld refinement | - |
dc.subject | Waterworks sludge | - |
dc.title | Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials | en_US |
dc.type | Article | en_US |
dc.identifier.email | Shih, K: kshih@hkucc.hku.hk | en_US |
dc.identifier.authority | Shih, K=rp00167 | en_US |
dc.identifier.doi | 10.1016/j.wasman.2013.07.001 | - |
dc.identifier.scopus | eid_2-s2.0-84900542540 | - |
dc.identifier.hkuros | 237121 | en_US |
dc.identifier.volume | 34 | en_US |
dc.identifier.spage | 1085 | en_US |
dc.identifier.epage | 1091 | en_US |
dc.identifier.isi | WOS:000337208600018 | - |