File Download

There are no files associated with this item.

Supplementary

Article: Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials

TitleCopper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials
Authors
Issue Date2014
Citation
Waste Management, 2014, v. 34, p. 1085-1091 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/202690

 

DC FieldValueLanguage
dc.contributor.authorTANG, Yen_US
dc.contributor.authorChan, S-Wen_US
dc.contributor.authorShih, Ken_US
dc.date.accessioned2014-09-19T09:14:17Z-
dc.date.available2014-09-19T09:14:17Z-
dc.date.issued2014en_US
dc.identifier.citationWaste Management, 2014, v. 34, p. 1085-1091en_US
dc.identifier.urihttp://hdl.handle.net/10722/202690-
dc.languageengen_US
dc.relation.ispartofWaste Managementen_US
dc.titleCopper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materialsen_US
dc.typeArticleen_US
dc.identifier.emailShih, K: kshih@hkucc.hku.hken_US
dc.identifier.authorityShih, K=rp00167en_US
dc.identifier.hkuros237121en_US
dc.identifier.volume34en_US
dc.identifier.spage1085en_US
dc.identifier.epage1091en_US

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats