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Conference Paper: Recent development of surface integral equation solvers for multiscale interconnects and circuits

TitleRecent development of surface integral equation solvers for multiscale interconnects and circuits
Authors
Sun, SJiang, LChew, WC
KeywordsComputational electromagnetics
Integral equation
Interconnects
Muitiscale
Circuit modeling
Issue Date2013
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000853
Citation
The 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC 2013), Hong Kong, China, 3-5 June 2013. In Conference Proceedings, 2013, p. 1-2 How to Cite?
DOI: http://dx.doi.org/10.1109/EDSSC.2013.6628158
AbstractThis paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated.
Persistent Identifierhttp://hdl.handle.net/10722/189888
ISBN
978-1-4673-2523-3

 

DC FieldValueLanguage
dc.contributor.authorSun, Sen_US
dc.contributor.authorJiang, Len_US
dc.contributor.authorChew, WCen_US
dc.date.accessioned2013-09-17T15:01:06Z-
dc.date.available2013-09-17T15:01:06Z-
dc.date.issued2013-
dc.identifier.citationThe 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC 2013), Hong Kong, China, 3-5 June 2013. In Conference Proceedings, 2013, p. 1-2en_US
dc.identifier.isbn978-1-4673-2523-3-
dc.identifier.urihttp://hdl.handle.net/10722/189888-
dc.description.abstractThis paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated.-
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000853-
dc.relation.ispartofIEEE Conference on Electron Devices and Solid-State Circuits Proceedingsen_US
dc.subjectComputational electromagnetics-
dc.subjectIntegral equation-
dc.subjectInterconnects-
dc.subjectMuitiscale-
dc.subjectCircuit modeling-
dc.titleRecent development of surface integral equation solvers for multiscale interconnects and circuitsen_US
dc.typeConference_Paperen_US
dc.identifier.emailSun, S: sunsheng@hku.hken_US
dc.identifier.emailJiang, L: jianglj@hku.hken_US
dc.identifier.emailChew, WC: wcchew@hkucc.hku.hken_US
dc.identifier.authoritySun, S=rp01431en_US
dc.identifier.authorityJiang, L=rp01338en_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/EDSSC.2013.6628158-
dc.identifier.scopuseid_2-s2.0-84890457123-
dc.identifier.hkuros223624en_US
dc.identifier.spage1-
dc.identifier.epage2-
dc.publisher.placeUnited States-
dc.customcontrol.immutablesml 131031-

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