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Article: Numerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulation

TitleNumerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulation
Authors
Issue Date2012
PublisherIEEE.
IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=20
Citation
IEEE Transactions on Magnetics, 2012, v. 48 n. 11, p. 4253-4256 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/189053

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_US
dc.contributor.authorHo, SLen_US
dc.contributor.authorFu, WNen_US
dc.date.accessioned2013-09-17T14:24:49Z-
dc.date.available2013-09-17T14:24:49Z-
dc.date.issued2012en_US
dc.identifier.citationIEEE Transactions on Magnetics, 2012, v. 48 n. 11, p. 4253-4256en_US
dc.identifier.urihttp://hdl.handle.net/10722/189053-
dc.languageengen_US
dc.publisherIEEE.en_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=20-
dc.relation.ispartofIEEE Transactions on Magneticsen_US
dc.rightsIEEE Transactions on Magnetics. Copyright © IEEE.en_US
dc.rights©2012 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_US
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.titleNumerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulationen_US
dc.typeArticleen_US
dc.identifier.emailChen, Q: q1chen@hku.hken_US
dc.identifier.authorityChen, Q=rp01688en_US
dc.description.naturepublished_or_final_version-
dc.identifier.hkuros222538en_US
dc.identifier.volume48en_US
dc.identifier.spage4253en_US
dc.identifier.epage4256en_US

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