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Conference Paper: Improvement for scattering by a thin dielectric sheet using surface integral equation

TitleImprovement for scattering by a thin dielectric sheet using surface integral equation
Authors
Issue Date2005
PublisherI E E E. The Journal's web site is located at http://www.ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000033
Citation
Ieee Antennas And Propagation Society, Ap-S International Symposium (Digest), 2005, v. 4 B, p. 380-383 How to Cite?
AbstractA modified D-field surface integral equation (SIE),which can be easily solved by the method of moments (MoM), is given for scattering by a thin dielectric sheet (TDS). This new TDS integral equation takes both tangential and normal currents into account. In addition, surface charge is considered as well. Using both RWG and pulse basis functions, tangential and normal currents can be solved simultaneously. Numerical examples are compared to the Mie series and volume integral equation (VIE) solutions. Improvement and agreement are achieved by this new method, especially when the dielectric constant is low. © 2005 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/182981
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorChiang, ITen_US
dc.contributor.authorChew, WCen_US
dc.date.accessioned2013-05-02T05:17:58Z-
dc.date.available2013-05-02T05:17:58Z-
dc.date.issued2005en_US
dc.identifier.citationIeee Antennas And Propagation Society, Ap-S International Symposium (Digest), 2005, v. 4 B, p. 380-383en_US
dc.identifier.issn1522-3965en_US
dc.identifier.urihttp://hdl.handle.net/10722/182981-
dc.description.abstractA modified D-field surface integral equation (SIE),which can be easily solved by the method of moments (MoM), is given for scattering by a thin dielectric sheet (TDS). This new TDS integral equation takes both tangential and normal currents into account. In addition, surface charge is considered as well. Using both RWG and pulse basis functions, tangential and normal currents can be solved simultaneously. Numerical examples are compared to the Mie series and volume integral equation (VIE) solutions. Improvement and agreement are achieved by this new method, especially when the dielectric constant is low. © 2005 IEEE.en_US
dc.languageengen_US
dc.publisherI E E E. The Journal's web site is located at http://www.ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000033en_US
dc.relation.ispartofIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)en_US
dc.titleImprovement for scattering by a thin dielectric sheet using surface integral equationen_US
dc.typeConference_Paperen_US
dc.identifier.emailChew, WC: wcchew@hku.hken_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/APS.2005.1552828en_US
dc.identifier.scopuseid_2-s2.0-33846932822en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33846932822&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume4 Ben_US
dc.identifier.spage380en_US
dc.identifier.epage383en_US
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridChiang, IT=7006017692en_US
dc.identifier.scopusauthoridChew, WC=36014436300en_US

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