File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Generalized impedance boundary condition for conductor modeling in surface integral equation

TitleGeneralized impedance boundary condition for conductor modeling in surface integral equation
Authors
KeywordsFull-Wave Solver
Generalized Impedance Boundary Condition
Impedance Boundary Condition
Interconnects
Loop Tree
Mixed-Form Fast Multipole Algorithm
Skin Effect
Surface Integral Equation
Issue Date2007
Citation
Ieee Transactions On Microwave Theory And Techniques, 2007, v. 55 n. 11, p. 2354-2364 How to Cite?
AbstractA generalized impedance boundary condition is developed to rigorously model on-chip interconnects in the full-wave surface integral equation by a two-region formulation. It is a combination of the electric-field integral equation for the exterior region and the magnetic-field integral equation for the interior conductive region. The skin effect is, therefore, well captured. A novel integration technique is proposed to evaluate the Green's function integrals in the conductive medium. Towards tackling large-scale problems, the mixed-form fast multipole algorithm and the multifrontal method are incorporated. A new scheme of the loop-tree decomposition is also used to alleviate the low-frequency breakdown for the formulation. Numerical examples show the accuracy and reduced computation cost. © 2007 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/182736
ISSN
2015 Impact Factor: 2.284
2015 SCImago Journal Rankings: 1.346
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorQian, ZGen_US
dc.contributor.authorChew, WCen_US
dc.contributor.authorSuaya, Ren_US
dc.date.accessioned2013-05-02T05:16:39Z-
dc.date.available2013-05-02T05:16:39Z-
dc.date.issued2007en_US
dc.identifier.citationIeee Transactions On Microwave Theory And Techniques, 2007, v. 55 n. 11, p. 2354-2364en_US
dc.identifier.issn0018-9480en_US
dc.identifier.urihttp://hdl.handle.net/10722/182736-
dc.description.abstractA generalized impedance boundary condition is developed to rigorously model on-chip interconnects in the full-wave surface integral equation by a two-region formulation. It is a combination of the electric-field integral equation for the exterior region and the magnetic-field integral equation for the interior conductive region. The skin effect is, therefore, well captured. A novel integration technique is proposed to evaluate the Green's function integrals in the conductive medium. Towards tackling large-scale problems, the mixed-form fast multipole algorithm and the multifrontal method are incorporated. A new scheme of the loop-tree decomposition is also used to alleviate the low-frequency breakdown for the formulation. Numerical examples show the accuracy and reduced computation cost. © 2007 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofIEEE Transactions on Microwave Theory and Techniquesen_US
dc.subjectFull-Wave Solveren_US
dc.subjectGeneralized Impedance Boundary Conditionen_US
dc.subjectImpedance Boundary Conditionen_US
dc.subjectInterconnectsen_US
dc.subjectLoop Treeen_US
dc.subjectMixed-Form Fast Multipole Algorithmen_US
dc.subjectSkin Effecten_US
dc.subjectSurface Integral Equationen_US
dc.titleGeneralized impedance boundary condition for conductor modeling in surface integral equationen_US
dc.typeArticleen_US
dc.identifier.emailChew, WC: wcchew@hku.hken_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/TMTT.2007.908678en_US
dc.identifier.scopuseid_2-s2.0-36649018525en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-36649018525&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume55en_US
dc.identifier.issue11en_US
dc.identifier.spage2354en_US
dc.identifier.epage2364en_US
dc.identifier.isiWOS:000250897400010-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridQian, ZG=9043842600en_US
dc.identifier.scopusauthoridChew, WC=36014436300en_US
dc.identifier.scopusauthoridSuaya, R=6506696200en_US

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats