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Article: Scattering solution of oblong dielectric coated, metallic scatterers by recursive algorithm

TitleScattering solution of oblong dielectric coated, metallic scatterers by recursive algorithm
Authors
Issue Date1992
PublisherThe Institution of Engineering and Technology. The Journal's web site is located at http://www.ieedl.org/EL
Citation
Electronics Letters, 1992, v. 28 n. 2, p. 185-187 How to Cite?
AbstractThe recursive aggregate T-matrix algorithm is used for the scattering solution of an oblong, multilayer, dielectric coated ogive body. Because the recurtive algorithm has reduced computational complexity and memory requirement, the scattering solution of a 10-wavelength long ogive coated with dielectric layers can be calculated on a PC and the solution agrees well with the method of moments.
Persistent Identifierhttp://hdl.handle.net/10722/182520
ISSN
2015 Impact Factor: 0.854
2015 SCImago Journal Rankings: 0.549

 

DC FieldValueLanguage
dc.contributor.authorLin, JHen_US
dc.contributor.authorChew, WCen_US
dc.date.accessioned2013-05-02T05:15:42Z-
dc.date.available2013-05-02T05:15:42Z-
dc.date.issued1992en_US
dc.identifier.citationElectronics Letters, 1992, v. 28 n. 2, p. 185-187en_US
dc.identifier.issn0013-5194en_US
dc.identifier.urihttp://hdl.handle.net/10722/182520-
dc.description.abstractThe recursive aggregate T-matrix algorithm is used for the scattering solution of an oblong, multilayer, dielectric coated ogive body. Because the recurtive algorithm has reduced computational complexity and memory requirement, the scattering solution of a 10-wavelength long ogive coated with dielectric layers can be calculated on a PC and the solution agrees well with the method of moments.en_US
dc.languageengen_US
dc.publisherThe Institution of Engineering and Technology. The Journal's web site is located at http://www.ieedl.org/ELen_US
dc.relation.ispartofElectronics Lettersen_US
dc.titleScattering solution of oblong dielectric coated, metallic scatterers by recursive algorithmen_US
dc.typeArticleen_US
dc.identifier.emailChew, WC: wcchew@hku.hken_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0026765273en_US
dc.identifier.volume28en_US
dc.identifier.issue2en_US
dc.identifier.spage185en_US
dc.identifier.epage187en_US
dc.publisher.placeUnited Kingdomen_US
dc.identifier.scopusauthoridLin, JH=8148328500en_US
dc.identifier.scopusauthoridChew, WC=36014436300en_US

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