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Article: Susceptibility of electronic insulating polyimides to microbial degradation

TitleSusceptibility of electronic insulating polyimides to microbial degradation
Authors
Issue Date1996
PublisherJohn Wiley & Sons, Inc. The Journal's web site is located at http://www.interscience.wiley.com/jpages/0021-8995/
Citation
Journal Of Applied Polymer Science, 1996, v. 62 n. 7, p. 1029-1034 How to Cite?
AbstractWe used electrochemical impedance spectroscopy (EIS) to investigate microbial degradation of polyimides used as insulators in electronic packaging. The microbial inoculum was a fungal consortium isolated from degraded polyimides. Microorganisms grew on these polymers yielding distinctive EIS spectra indicative of failure. Degradation appeared to occur in a number of steps. Two distinctive stages in the decline of film resistance were observed in the inoculated EIS cells within 17 and 72 days after inoculation. The early stage of resistance decrease may be related to the ingress of water molecules and ionic species into the polymeric materials, whereas the second stage probably resulted from partial degradation of the polymers by fungal growth on the polymer film. The active fungal consortium was comprised of Aspergillus versicolor, Cladosporium cladosporioides, and a Chaetomium species. All of these fungi are common environmental contaminants. The relationship between changes of impedance spectra and microbial degradation of the coatings was supported by scanning electron microscopic observations of fungi on the surface of the inoculated polyimides. Our data indicate that the insulating polyimides used in electronic applications are susceptible to fungal degradation under appropriate environmental conditions, particularly in the presence of moisture. © 1996 John Wiley & Sons, Inc.
Persistent Identifierhttp://hdl.handle.net/10722/178590
ISSN
2015 Impact Factor: 1.866
2015 SCImago Journal Rankings: 0.578
References

 

DC FieldValueLanguage
dc.contributor.authorGu, JDen_US
dc.contributor.authorFord, TEen_US
dc.contributor.authorMitchell, Ren_US
dc.date.accessioned2012-12-19T09:48:32Z-
dc.date.available2012-12-19T09:48:32Z-
dc.date.issued1996en_US
dc.identifier.citationJournal Of Applied Polymer Science, 1996, v. 62 n. 7, p. 1029-1034en_US
dc.identifier.issn0021-8995en_US
dc.identifier.urihttp://hdl.handle.net/10722/178590-
dc.description.abstractWe used electrochemical impedance spectroscopy (EIS) to investigate microbial degradation of polyimides used as insulators in electronic packaging. The microbial inoculum was a fungal consortium isolated from degraded polyimides. Microorganisms grew on these polymers yielding distinctive EIS spectra indicative of failure. Degradation appeared to occur in a number of steps. Two distinctive stages in the decline of film resistance were observed in the inoculated EIS cells within 17 and 72 days after inoculation. The early stage of resistance decrease may be related to the ingress of water molecules and ionic species into the polymeric materials, whereas the second stage probably resulted from partial degradation of the polymers by fungal growth on the polymer film. The active fungal consortium was comprised of Aspergillus versicolor, Cladosporium cladosporioides, and a Chaetomium species. All of these fungi are common environmental contaminants. The relationship between changes of impedance spectra and microbial degradation of the coatings was supported by scanning electron microscopic observations of fungi on the surface of the inoculated polyimides. Our data indicate that the insulating polyimides used in electronic applications are susceptible to fungal degradation under appropriate environmental conditions, particularly in the presence of moisture. © 1996 John Wiley & Sons, Inc.en_US
dc.languageengen_US
dc.publisherJohn Wiley & Sons, Inc. The Journal's web site is located at http://www.interscience.wiley.com/jpages/0021-8995/en_US
dc.relation.ispartofJournal of Applied Polymer Scienceen_US
dc.titleSusceptibility of electronic insulating polyimides to microbial degradationen_US
dc.typeArticleen_US
dc.identifier.emailGu, JD: jdgu@hkucc.hku.hken_US
dc.identifier.authorityGu, JD=rp00701en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0030282818en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0030282818&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume62en_US
dc.identifier.issue7en_US
dc.identifier.spage1029en_US
dc.identifier.epage1034en_US
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridGu, JD=7403129601en_US
dc.identifier.scopusauthoridFord, TE=26634948200en_US
dc.identifier.scopusauthoridMitchell, R=7403974570en_US

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