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Conference Paper: Intergranular coupling and activation volume of Co ferrite thin films with high coercivity above 3 kOe

TitleIntergranular coupling and activation volume of Co ferrite thin films with high coercivity above 3 kOe
Authors
Issue Date1999
Citation
Digests Of The Intermag Conference, 1999, p. DR-16 How to Cite?
AbstractFerrite films composed of Co ions and Fe ones were deposited at the substrate temperature of 90°C by the ferrite-plating method. The films were post-annealed at 250°C in the air for 1 hour to increase the coercivity. Intergranular coupling among magnetic grains were evaluated and the activation volumes were estimated. The results show that a small amount of Co addition will open to develop ferrite film media with high coercivity above 3 kOe and low noise level.
Persistent Identifierhttp://hdl.handle.net/10722/176152
ISSN

 

DC FieldValueLanguage
dc.contributor.authorKitamoto, Yen_US
dc.contributor.authorZhang, Fen_US
dc.contributor.authorKantake, Sen_US
dc.contributor.authorShirasaki, Fen_US
dc.contributor.authorAbe, Men_US
dc.contributor.authorNaoe, Men_US
dc.date.accessioned2012-11-26T09:06:28Z-
dc.date.available2012-11-26T09:06:28Z-
dc.date.issued1999en_US
dc.identifier.citationDigests Of The Intermag Conference, 1999, p. DR-16en_US
dc.identifier.issn0074-6843en_US
dc.identifier.urihttp://hdl.handle.net/10722/176152-
dc.description.abstractFerrite films composed of Co ions and Fe ones were deposited at the substrate temperature of 90°C by the ferrite-plating method. The films were post-annealed at 250°C in the air for 1 hour to increase the coercivity. Intergranular coupling among magnetic grains were evaluated and the activation volumes were estimated. The results show that a small amount of Co addition will open to develop ferrite film media with high coercivity above 3 kOe and low noise level.en_US
dc.languageengen_US
dc.relation.ispartofDigests of the Intermag Conferenceen_US
dc.titleIntergranular coupling and activation volume of Co ferrite thin films with high coercivity above 3 kOeen_US
dc.typeConference_Paperen_US
dc.identifier.emailZhang, F: fuchun@hkucc.hku.hken_US
dc.identifier.authorityZhang, F=rp00840en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0033299455en_US
dc.identifier.spageDRen_US
dc.identifier.epage16en_US
dc.identifier.scopusauthoridKitamoto, Y=7006209500en_US
dc.identifier.scopusauthoridZhang, F=14012468800en_US
dc.identifier.scopusauthoridKantake, S=7801632320en_US
dc.identifier.scopusauthoridShirasaki, F=23026214400en_US
dc.identifier.scopusauthoridAbe, M=35399559100en_US
dc.identifier.scopusauthoridNaoe, M=35467285400en_US

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