Article: Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides

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TitleStudy on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
AuthorsShen, J
Zhang, Y
Huang, M
Wang, W
Xu, Z
Yeung, KWK1
Yi, C
Xu, M
KeywordsEpoxy resin
Hydroxyl-containing diamine
Reactive polyimide
Thermal stability
Issue Date2012
PublisherSpringer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760
CitationJournal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 [How to Cite?]
DOI: http://dx.doi.org/10.1007/s10965-012-9857-x
AbstractNovel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012.
ISSN1022-9760
2011 Impact Factor: 1.733
2011 SCImago Journal Rankings: 0.076
DOIhttp://dx.doi.org/10.1007/s10965-012-9857-x
ReferencesReferences in Scopus
DC Field
Value
dc.contributor.authorShen, J
dc.contributor.authorZhang, Y
dc.contributor.authorHuang, M
dc.contributor.authorWang, W
dc.contributor.authorXu, Z
dc.contributor.authorYeung, KWK
dc.contributor.authorYi, C
dc.contributor.authorXu, M
dc.date.accessioned2012-08-16T05:55:30Z
dc.date.available2012-08-16T05:55:30Z
dc.date.issued2012
dc.description.abstractNovel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012.
dc.description.natureLink_to_subscribed_fulltext
dc.identifier.citationJournal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 [How to Cite?]
DOI: http://dx.doi.org/10.1007/s10965-012-9857-x
dc.identifier.citeulike10636640
dc.identifier.doihttp://dx.doi.org/10.1007/s10965-012-9857-x
dc.identifier.hkuros204524
dc.identifier.issn1022-9760
2011 Impact Factor: 1.733
2011 SCImago Journal Rankings: 0.076
dc.identifier.issue5
dc.identifier.scopuseid_2-s2.0-84859447955
dc.identifier.urihttp://hdl.handle.net/10722/159748
dc.identifier.volume19
dc.languageeng
dc.publisherSpringer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760
dc.publisher.placeNetherlands
dc.relation.ispartofJournal of Polymer Research
dc.relation.referencesReferences in Scopus
dc.subjectEpoxy resin
dc.subjectHydroxyl-containing diamine
dc.subjectReactive polyimide
dc.subjectThermal stability
dc.titleStudy on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
dc.typeArticle
Author Affiliations
  1. The University of Hong Kong
  2. Hubei University