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Article: Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
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TitleStudy on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
 
AuthorsShen, J2
Zhang, Y2
Huang, M2
Wang, W1
Xu, Z2 1
Yeung, KWK1
Yi, C2 1
Xu, M2
 
KeywordsEpoxy resin
Hydroxyl-containing diamine
Reactive polyimide
Thermal stability
 
Issue Date2012
 
PublisherSpringer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760
 
CitationJournal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 [How to Cite?]
DOI: http://dx.doi.org/10.1007/s10965-012-9857-x
 
AbstractNovel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012.
 
ISSN1022-9760
2013 Impact Factor: 1.897
 
DOIhttp://dx.doi.org/10.1007/s10965-012-9857-x
 
ReferencesReferences in Scopus
 
DC FieldValue
dc.contributor.authorShen, J
 
dc.contributor.authorZhang, Y
 
dc.contributor.authorHuang, M
 
dc.contributor.authorWang, W
 
dc.contributor.authorXu, Z
 
dc.contributor.authorYeung, KWK
 
dc.contributor.authorYi, C
 
dc.contributor.authorXu, M
 
dc.date.accessioned2012-08-16T05:55:30Z
 
dc.date.available2012-08-16T05:55:30Z
 
dc.date.issued2012
 
dc.description.abstractNovel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012.
 
dc.description.natureLink_to_subscribed_fulltext
 
dc.identifier.citationJournal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 [How to Cite?]
DOI: http://dx.doi.org/10.1007/s10965-012-9857-x
 
dc.identifier.citeulike10636640
 
dc.identifier.doihttp://dx.doi.org/10.1007/s10965-012-9857-x
 
dc.identifier.hkuros204524
 
dc.identifier.issn1022-9760
2013 Impact Factor: 1.897
 
dc.identifier.issue5
 
dc.identifier.scopuseid_2-s2.0-84859447955
 
dc.identifier.urihttp://hdl.handle.net/10722/159748
 
dc.identifier.volume19
 
dc.languageeng
 
dc.publisherSpringer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760
 
dc.publisher.placeNetherlands
 
dc.relation.ispartofJournal of Polymer Research
 
dc.relation.referencesReferences in Scopus
 
dc.subjectEpoxy resin
 
dc.subjectHydroxyl-containing diamine
 
dc.subjectReactive polyimide
 
dc.subjectThermal stability
 
dc.titleStudy on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
 
dc.typeArticle
 
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<contributor.author>Wang, W</contributor.author>
<contributor.author>Xu, Z</contributor.author>
<contributor.author>Yeung, KWK</contributor.author>
<contributor.author>Yi, C</contributor.author>
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<description.abstract>Novel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 &#176;C, the temperature at 10 % weight loss of 524.1-579.3 &#176;C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 &#176;C for 0 %, 309 &#176;C for 1.95 %, 337 &#176;C for 3.85 % and 350 &#176;C for 5.63 %. &#169; Springer Science+Business Media B.V. 2012.</description.abstract>
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Author Affiliations
  1. The University of Hong Kong
  2. Hubei University