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Article: Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides

TitleStudy on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
Authors
KeywordsEpoxy resin
Hydroxyl-containing diamine
Reactive polyimide
Thermal stability
Issue Date2012
PublisherSpringer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760
Citation
Journal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 How to Cite?
AbstractNovel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012.
Persistent Identifierhttp://hdl.handle.net/10722/159748
ISSN
2014 Impact Factor: 1.920
2014 SCImago Journal Rankings: 0.608
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorShen, Jen_HK
dc.contributor.authorZhang, Yen_HK
dc.contributor.authorHuang, Men_HK
dc.contributor.authorWang, Wen_HK
dc.contributor.authorXu, Zen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorYi, Cen_HK
dc.contributor.authorXu, Men_HK
dc.date.accessioned2012-08-16T05:55:30Z-
dc.date.available2012-08-16T05:55:30Z-
dc.date.issued2012en_HK
dc.identifier.citationJournal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857en_HK
dc.identifier.issn1022-9760en_HK
dc.identifier.urihttp://hdl.handle.net/10722/159748-
dc.description.abstractNovel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012.en_HK
dc.languageengen_US
dc.publisherSpringer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760en_HK
dc.relation.ispartofJournal of Polymer Researchen_HK
dc.subjectEpoxy resinen_HK
dc.subjectHydroxyl-containing diamineen_HK
dc.subjectReactive polyimideen_HK
dc.subjectThermal stabilityen_HK
dc.titleStudy on preparation and properties of novel reactive phenolic hydroxyl-containing polyimidesen_HK
dc.typeArticleen_HK
dc.identifier.emailYeung, KWK:wkkyeung@hkucc.hku.hken_HK
dc.identifier.authorityYeung, KWK=rp00309en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s10965-012-9857-xen_HK
dc.identifier.scopuseid_2-s2.0-84859447955en_HK
dc.identifier.hkuros204524en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-84859447955&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume19en_HK
dc.identifier.issue5en_HK
dc.identifier.isiWOS:000304135400003-
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridShen, J=55080338600en_HK
dc.identifier.scopusauthoridZhang, Y=55177389800en_HK
dc.identifier.scopusauthoridHuang, M=37039163300en_HK
dc.identifier.scopusauthoridWang, W=53980654200en_HK
dc.identifier.scopusauthoridXu, Z=12760201200en_HK
dc.identifier.scopusauthoridYeung, KWK=13309584700en_HK
dc.identifier.scopusauthoridYi, C=7101997365en_HK
dc.identifier.scopusauthoridXu, M=15123314800en_HK
dc.identifier.citeulike10636640-
dc.customcontrol.immutablejt 130429-

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