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Conference Paper: Strength and fracture of single crystal metal nanowire

TitleStrength and fracture of single crystal metal nanowire
Authors
KeywordsFracture
Mechanical Property
Metal Nanowire
Molecular Dynamics Simulation
Size Effect
Strain Rate
Strength
Issue Date2004
PublisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net
Citation
Key Engineering Materials, 2004, v. 261-263 I, p. 33-38 How to Cite?
AbstractNumerical simulations have been carried out to determine the mechanical property of single crystal copper nanowire subjected to tension using the molecular dynamics method. The mechanism of deformation, strength and fracture are elucidated based on these numerical simulations. No strengthening is found after yielding of the single crystal nanowire. The simulation results show that the strength of copper nanowire is far greater than that of realistic polycrystalline bulk copper. By decreasing the size of the nanowire's cross-section, which leads to an increase of the ratio of surface atoms, the yield stress is increased. The strain rate has an influence on strength, and mechanism of deformation and fracture. When the strain rate is comparatively low, plastic deformation arises from dislocation slips and twins. However, when the strain rate is sufficiently high, amorphization is a dominant factor of plastic deformation and super-plasticity is found. The fracture process is demonstrated using the atomic images.
Persistent Identifierhttp://hdl.handle.net/10722/158954
ISSN
2005 Impact Factor: 0.224
2015 SCImago Journal Rankings: 0.173
References

 

DC FieldValueLanguage
dc.contributor.authorWu, HAen_US
dc.contributor.authorSoh, AKen_US
dc.contributor.authorWang, XXen_US
dc.contributor.authorSun, ZHen_US
dc.date.accessioned2012-08-08T09:04:45Z-
dc.date.available2012-08-08T09:04:45Z-
dc.date.issued2004en_US
dc.identifier.citationKey Engineering Materials, 2004, v. 261-263 I, p. 33-38en_US
dc.identifier.issn1013-9826en_US
dc.identifier.urihttp://hdl.handle.net/10722/158954-
dc.description.abstractNumerical simulations have been carried out to determine the mechanical property of single crystal copper nanowire subjected to tension using the molecular dynamics method. The mechanism of deformation, strength and fracture are elucidated based on these numerical simulations. No strengthening is found after yielding of the single crystal nanowire. The simulation results show that the strength of copper nanowire is far greater than that of realistic polycrystalline bulk copper. By decreasing the size of the nanowire's cross-section, which leads to an increase of the ratio of surface atoms, the yield stress is increased. The strain rate has an influence on strength, and mechanism of deformation and fracture. When the strain rate is comparatively low, plastic deformation arises from dislocation slips and twins. However, when the strain rate is sufficiently high, amorphization is a dominant factor of plastic deformation and super-plasticity is found. The fracture process is demonstrated using the atomic images.en_US
dc.languageengen_US
dc.publisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.neten_US
dc.relation.ispartofKey Engineering Materialsen_US
dc.subjectFractureen_US
dc.subjectMechanical Propertyen_US
dc.subjectMetal Nanowireen_US
dc.subjectMolecular Dynamics Simulationen_US
dc.subjectSize Effecten_US
dc.subjectStrain Rateen_US
dc.subjectStrengthen_US
dc.titleStrength and fracture of single crystal metal nanowireen_US
dc.typeConference_Paperen_US
dc.identifier.emailSoh, AK:aksoh@hkucc.hku.hken_US
dc.identifier.authoritySoh, AK=rp00170en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-3142656686en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-3142656686&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume261-263en_US
dc.identifier.issueIen_US
dc.identifier.spage33en_US
dc.identifier.epage38en_US
dc.publisher.placeSwitzerlanden_US
dc.identifier.scopusauthoridWu, HA=35325938300en_US
dc.identifier.scopusauthoridSoh, AK=7006795203en_US
dc.identifier.scopusauthoridWang, XX=7501854488en_US
dc.identifier.scopusauthoridSun, ZH=7404239574en_US

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