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Conference Paper: Mixed integral-differential skin-effect models for PEEC electromagnetic solver

TitleMixed integral-differential skin-effect models for PEEC electromagnetic solver
Authors
Keywords3-D shape
Broadband frequency
Electromagnetic problems
Electromagnetic solvers
Memory requirements
Issue Date2011
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000236
Citation
The IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2011), San Jose, CA., 23-26 October 2011. In Proceedings of IEEE 20th EPEPS, 2011, p. 177-180 How to Cite?
AbstractEfficient modeling of the broadband skin-effect for conducting 3D shapes is a challenging issue for the solution of large electromagnetic problems. The inclusion of such models in an EM solver can be very costly in compute time and memory requirements. Several properties of a model are desirable for the solution of practical problems such as the broadband frequency domain or the time domain applicability. In this paper, we present a model which meets some of these challenges and which is suitable for the PEEC solution method. © 2011 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/158767
ISBN
References

 

DC FieldValueLanguage
dc.contributor.authorAntonini, Gen_US
dc.contributor.authorRuehli, Aen_US
dc.contributor.authorJiang, Len_US
dc.date.accessioned2012-08-08T09:01:14Z-
dc.date.available2012-08-08T09:01:14Z-
dc.date.issued2011en_US
dc.identifier.citationThe IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2011), San Jose, CA., 23-26 October 2011. In Proceedings of IEEE 20th EPEPS, 2011, p. 177-180en_US
dc.identifier.isbn978-1-4244-9401-9-
dc.identifier.urihttp://hdl.handle.net/10722/158767-
dc.description.abstractEfficient modeling of the broadband skin-effect for conducting 3D shapes is a challenging issue for the solution of large electromagnetic problems. The inclusion of such models in an EM solver can be very costly in compute time and memory requirements. Several properties of a model are desirable for the solution of practical problems such as the broadband frequency domain or the time domain applicability. In this paper, we present a model which meets some of these challenges and which is suitable for the PEEC solution method. © 2011 IEEE.en_US
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000236-
dc.relation.ispartofIEEE Topical Meeting on Electrical Performance of Electronic Packaging Proceedingsen_US
dc.rightsIEEE Topical Meeting on Electrical Performance of Electronic Packaging Proceedings. Copyright © IEEE.-
dc.rights©2011 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.subject3-D shape-
dc.subjectBroadband frequency-
dc.subjectElectromagnetic problems-
dc.subjectElectromagnetic solvers-
dc.subjectMemory requirements-
dc.titleMixed integral-differential skin-effect models for PEEC electromagnetic solveren_US
dc.typeConference_Paperen_US
dc.identifier.emailAntonini, G: giulio.antonini@univaq.iten_US
dc.identifier.emailRuehli, A: albert.ruehli@gmail.com-
dc.identifier.emailJiang, L: jianglj@hku.hk-
dc.identifier.authorityJiang, L=rp01338en_US
dc.description.naturepublished_or_final_versionen_US
dc.identifier.doi10.1109/EPEPS.2011.6100220en_US
dc.identifier.scopuseid_2-s2.0-84855362362en_US
dc.identifier.hkuros210831-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-84855362362&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage177en_US
dc.identifier.epage180en_US
dc.publisher.placeUnited States-
dc.description.otherThe IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2011), San Jose, CA., 23-26 October 2011. In Proceedings of IEEE 20th EPEPS, 2011, p. 177-180-
dc.identifier.scopusauthoridJiang, L=36077777200en_US
dc.identifier.scopusauthoridRuehli, AE=7005598180en_US
dc.identifier.scopusauthoridAntonini, G=7102288569en_US

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