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Conference Paper: Automated optical inspection of solder paste based on 2.5D visual images

TitleAutomated optical inspection of solder paste based on 2.5D visual images
Authors
Pang, GKHChu, MH
KeywordsSurface Mount Technology Manufacturing
Solder Paste Printing Inspection
Process Automation
Fuzzy System
Issue Date2009
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1001093
Citation
The 2009 IEEE International Conference on Mechatronics and Automation (ICMA 2009), Changchun, China, 9-12 August 2009. In Conference Proceedings, 2009, p. 982-987 How to Cite?
DOI: http://dx.doi.org/10.1109/ICMA.2009.5246351
AbstractIn this paper, a special technique for the inspection of solder paste using directional LED lighting is presented. Conventional optical inspection method would depend on an image acquired from a camera mounted from the top. This 2D inspection of solder paste based on images is fast but is limited to defect such as bridge or no solder. Defects related to the volume of the printed solder paste or unevenness of the paste cannot be treated from a top image. The developed technique of this paper would involve the use of special directional side lighting to acquire two-and-a-half dimensional (2.5D) images from above the solder paste block. A sequence of three images is acquired and image processing is carried out for defect detection of the printed solder paste. The acquired images would highlight the geometrical features of the solder paste block. Solder paste inspection is then carried out based on the highlighted features. The proposed method can handle other types of defects that cannot be treated by conventional top light images. ©2009 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/158622
ISBN
978-1-4244-2693-5
ISI Accession Number ID
WOS:000280158100179
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorPang, GKHen_US
dc.contributor.authorChu, MHen_US
dc.date.accessioned2012-08-08T09:00:31Z-
dc.date.available2012-08-08T09:00:31Z-
dc.date.issued2009en_US
dc.identifier.citationThe 2009 IEEE International Conference on Mechatronics and Automation (ICMA 2009), Changchun, China, 9-12 August 2009. In Conference Proceedings, 2009, p. 982-987en_US
dc.identifier.isbn978-1-4244-2693-5-
dc.identifier.urihttp://hdl.handle.net/10722/158622-
dc.description.abstractIn this paper, a special technique for the inspection of solder paste using directional LED lighting is presented. Conventional optical inspection method would depend on an image acquired from a camera mounted from the top. This 2D inspection of solder paste based on images is fast but is limited to defect such as bridge or no solder. Defects related to the volume of the printed solder paste or unevenness of the paste cannot be treated from a top image. The developed technique of this paper would involve the use of special directional side lighting to acquire two-and-a-half dimensional (2.5D) images from above the solder paste block. A sequence of three images is acquired and image processing is carried out for defect detection of the printed solder paste. The acquired images would highlight the geometrical features of the solder paste block. Solder paste inspection is then carried out based on the highlighted features. The proposed method can handle other types of defects that cannot be treated by conventional top light images. ©2009 IEEE.en_US
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1001093-
dc.relation.ispartofIEEE International Conference on Mechatronics and Automation Proceedingsen_US
dc.rights©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subjectSurface Mount Technology Manufacturingen_US
dc.subjectSolder Paste Printing Inspectionen_US
dc.subjectProcess Automationen_US
dc.subjectFuzzy Systemen_US
dc.titleAutomated optical inspection of solder paste based on 2.5D visual imagesen_US
dc.typeConference_Paperen_US
dc.identifier.emailPang, GKH: gpang@eee.hku.hken_US
dc.identifier.authorityPang, GKH=rp00162en_US
dc.description.naturepublished_or_final_versionen_US
dc.identifier.doi10.1109/ICMA.2009.5246351en_US
dc.identifier.scopuseid_2-s2.0-77449112508en_US
dc.identifier.hkuros168565-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77449112508&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage982en_US
dc.identifier.epage987en_US
dc.identifier.isiWOS:000280158100179-
dc.publisher.placeUnited States-
dc.identifier.scopusauthoridChu, MH=47461010000en_US
dc.identifier.scopusauthoridPang, GKH=7103393283en_US
dc.customcontrol.immutablesml 140523-

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