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Conference Paper: Boundary detection of projected fringes on surface with inhomogeneous reflectance function

TitleBoundary detection of projected fringes on surface with inhomogeneous reflectance function
Authors
KeywordsBinary Pattern
Boundary Detection
Inhomogeneous Reflectance
Projected Fringe
Issue Date2006
PublisherSPIE - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Citation
The 14th Machine Vision Applications in Industrial Inspection Conference, San Jose, CA., 15 January2006. In SPIE Proceedings, 2006, v. 6070, p. 17-26 How to Cite?
AbstractA challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a novel mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary pattern to the surface and capturing image of the illuminated scene. By shifting the binary pattern in space and every time taking a separate image of the illuminated surface, each position on the illuminated surface will be attached with a binary code in the sequence of images taken. 3D information about the bump surface can then be obtained over these coded points via triangulation. However, when a binary pattern is projected onto the inspected surface through projection lenses, the high order harmonics of the pattern are often diminished because of the lens' limited bandwidth. This will lead to blurring of the projected fringe boundaries in the captured image data and make differentiation between dark and bright fringes there difficult. In addition, different compositions of the target surface, some metallic (the solder surface) and some not (the substrate surface of the wafer), have different reflectance functions (including both the specular and lambertian components). This makes fringe boundary detection in the image data an even more challenging problem. This paper proposes a solution to the problem. It makes use of the spatial-temporal image volume over the target surface to tackle the issue of inhomogeneous reflectance function. It is shown that the observed intensity profile across the images of a fixed point has the same up-and-down profile of the orignal binary gratings, regardless of the reflectance on the target surface, from which edges can be detected using classical methods like the gradient based ones. Preliminary study through theoretical analysis and empirical experiments on real image data demonstrate the feasibility of proposed approach. © 2006 SPIE-IS&T.
Persistent Identifierhttp://hdl.handle.net/10722/158439
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorCheng, Jen_US
dc.contributor.authorChung, Ren_US
dc.contributor.authorLam, EYMen_US
dc.contributor.authorFung, KSMen_US
dc.contributor.authorWang, Fen_US
dc.contributor.authorLeung, WHen_US
dc.date.accessioned2012-08-08T08:59:38Z-
dc.date.available2012-08-08T08:59:38Z-
dc.date.issued2006en_US
dc.identifier.citationThe 14th Machine Vision Applications in Industrial Inspection Conference, San Jose, CA., 15 January2006. In SPIE Proceedings, 2006, v. 6070, p. 17-26en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/10722/158439-
dc.description.abstractA challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a novel mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary pattern to the surface and capturing image of the illuminated scene. By shifting the binary pattern in space and every time taking a separate image of the illuminated surface, each position on the illuminated surface will be attached with a binary code in the sequence of images taken. 3D information about the bump surface can then be obtained over these coded points via triangulation. However, when a binary pattern is projected onto the inspected surface through projection lenses, the high order harmonics of the pattern are often diminished because of the lens' limited bandwidth. This will lead to blurring of the projected fringe boundaries in the captured image data and make differentiation between dark and bright fringes there difficult. In addition, different compositions of the target surface, some metallic (the solder surface) and some not (the substrate surface of the wafer), have different reflectance functions (including both the specular and lambertian components). This makes fringe boundary detection in the image data an even more challenging problem. This paper proposes a solution to the problem. It makes use of the spatial-temporal image volume over the target surface to tackle the issue of inhomogeneous reflectance function. It is shown that the observed intensity profile across the images of a fixed point has the same up-and-down profile of the orignal binary gratings, regardless of the reflectance on the target surface, from which edges can be detected using classical methods like the gradient based ones. Preliminary study through theoretical analysis and empirical experiments on real image data demonstrate the feasibility of proposed approach. © 2006 SPIE-IS&T.en_US
dc.languageengen_US
dc.publisherSPIE - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xmlen_US
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_US
dc.subjectBinary Patternen_US
dc.subjectBoundary Detectionen_US
dc.subjectInhomogeneous Reflectanceen_US
dc.subjectProjected Fringeen_US
dc.titleBoundary detection of projected fringes on surface with inhomogeneous reflectance functionen_US
dc.typeConference_Paperen_US
dc.identifier.emailLam, EYM: elam@eee.hku.hken_US
dc.identifier.authorityLam, EY=rp00131en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1117/12.648604en_US
dc.identifier.scopuseid_2-s2.0-33645684485en_US
dc.identifier.hkuros117402-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33645684485&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume6070en_US
dc.identifier.spage17-
dc.identifier.epage26-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridCheng, J=14057685600en_US
dc.identifier.scopusauthoridChung, R=7202439610en_US
dc.identifier.scopusauthoridLam, EY=7102890004en_US
dc.identifier.scopusauthoridFung, KSM=8627247700en_US
dc.identifier.scopusauthoridWang, F=7501312203en_US
dc.identifier.scopusauthoridLeung, WH=36956842400en_US
dc.customcontrol.immutablesml 160105 - merged-

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