Conference Paper: A novel design of grating projection system for 3D reconstruction of wafer bumps
| Title | A novel design of grating projection system for 3D reconstruction of wafer bumps |
|---|---|
| Authors | Shu, Y3 Chung, R4 Tan, Z3 Cheng, J4 Lam, EY2 Fung, KSM1 Wang, F1 |
| Keywords | 3D From Structured Light Depth Of Field Field Of View Lens Design Machine Vision Modulation Transfer Function |
| Issue Date | 2006 |
| Publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml |
| Citation | Proceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6056 [How to Cite?] DOI: http://dx.doi.org/10.1117/12.650023 |
| Abstract | A challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. © 2006 SPIE-IS&T. |
| ISSN | 0277-786X 2011 SCImago Journal Rankings: 0.046 |
| DOI | http://dx.doi.org/10.1117/12.650023 |
| References | References in Scopus |
| dc.contributor.author | Shu, Y |
|---|---|
| dc.contributor.author | Chung, R |
| dc.contributor.author | Tan, Z |
| dc.contributor.author | Cheng, J |
| dc.contributor.author | Lam, EY |
| dc.contributor.author | Fung, KSM |
| dc.contributor.author | Wang, F |
| dc.date.accessioned | 2012-08-08T08:59:37Z |
| dc.date.available | 2012-08-08T08:59:37Z |
| dc.date.issued | 2006 |
| dc.description.abstract | A challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. © 2006 SPIE-IS&T. |
| dc.description.nature | Link_to_subscribed_fulltext |
| dc.identifier.citation | Proceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6056 [How to Cite?] DOI: http://dx.doi.org/10.1117/12.650023 |
| dc.identifier.doi | http://dx.doi.org/10.1117/12.650023 |
| dc.identifier.issn | 0277-786X 2011 SCImago Journal Rankings: 0.046 |
| dc.identifier.scopus | eid_2-s2.0-33645504465 |
| dc.identifier.uri | http://hdl.handle.net/10722/158437 |
| dc.identifier.volume | 6056 |
| dc.language | eng |
| dc.publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml |
| dc.publisher.place | United States |
| dc.relation.ispartof | Proceedings of SPIE - The International Society for Optical Engineering |
| dc.relation.references | References in Scopus |
| dc.subject | 3D From Structured Light |
| dc.subject | Depth Of Field |
| dc.subject | Field Of View |
| dc.subject | Lens Design |
| dc.subject | Machine Vision |
| dc.subject | Modulation Transfer Function |
| dc.title | A novel design of grating projection system for 3D reconstruction of wafer bumps |
| dc.type | Conference_Paper |
Author Affiliations
- ASM Assembly Automation Ltd.
- The University of Hong Kong
- Xi'an Jiaotong University
- Chinese University of Hong Kong