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Conference Paper: A novel design of grating projection system for 3D reconstruction of wafer bumps
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TitleA novel design of grating projection system for 3D reconstruction of wafer bumps
 
AuthorsShu, Y3
Chung, R4
Tan, Z3
Cheng, J4
Lam, EY2
Fung, KSM1
Wang, F1
 
Keywords3D From Structured Light
Depth Of Field
Field Of View
Lens Design
Machine Vision
Modulation Transfer Function
 
Issue Date2006
 
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
 
CitationProceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6056 [How to Cite?]
DOI: http://dx.doi.org/10.1117/12.650023
 
AbstractA challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. © 2006 SPIE-IS&T.
 
ISSN0277-786X
2013 SCImago Journal Rankings: 0.203
 
DOIhttp://dx.doi.org/10.1117/12.650023
 
ReferencesReferences in Scopus
 
DC FieldValue
dc.contributor.authorShu, Y
 
dc.contributor.authorChung, R
 
dc.contributor.authorTan, Z
 
dc.contributor.authorCheng, J
 
dc.contributor.authorLam, EY
 
dc.contributor.authorFung, KSM
 
dc.contributor.authorWang, F
 
dc.date.accessioned2012-08-08T08:59:37Z
 
dc.date.available2012-08-08T08:59:37Z
 
dc.date.issued2006
 
dc.description.abstractA challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. © 2006 SPIE-IS&T.
 
dc.description.natureLink_to_subscribed_fulltext
 
dc.identifier.citationProceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6056 [How to Cite?]
DOI: http://dx.doi.org/10.1117/12.650023
 
dc.identifier.doihttp://dx.doi.org/10.1117/12.650023
 
dc.identifier.issn0277-786X
2013 SCImago Journal Rankings: 0.203
 
dc.identifier.scopuseid_2-s2.0-33645504465
 
dc.identifier.urihttp://hdl.handle.net/10722/158437
 
dc.identifier.volume6056
 
dc.languageeng
 
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
 
dc.publisher.placeUnited States
 
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineering
 
dc.relation.referencesReferences in Scopus
 
dc.subject3D From Structured Light
 
dc.subjectDepth Of Field
 
dc.subjectField Of View
 
dc.subjectLens Design
 
dc.subjectMachine Vision
 
dc.subjectModulation Transfer Function
 
dc.titleA novel design of grating projection system for 3D reconstruction of wafer bumps
 
dc.typeConference_Paper
 
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<contributor.author>Chung, R</contributor.author>
<contributor.author>Tan, Z</contributor.author>
<contributor.author>Cheng, J</contributor.author>
<contributor.author>Lam, EY</contributor.author>
<contributor.author>Fung, KSM</contributor.author>
<contributor.author>Wang, F</contributor.author>
<date.accessioned>2012-08-08T08:59:37Z</date.accessioned>
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<description.abstract>A challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. &#169; 2006 SPIE-IS&amp;T.</description.abstract>
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Author Affiliations
  1. ASM Assembly Automation Ltd.
  2. The University of Hong Kong
  3. Xi'an Jiaotong University
  4. Chinese University of Hong Kong