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Conference Paper: A novel design of grating projection system for 3D reconstruction of wafer bumps

TitleA novel design of grating projection system for 3D reconstruction of wafer bumps
Authors
Keywords3D From Structured Light
Depth Of Field
Field Of View
Lens Design
Machine Vision
Modulation Transfer Function
Issue Date2006
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Citation
Proceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6056 How to Cite?
Abstract
A challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. © 2006 SPIE-IS&T.
Persistent Identifierhttp://hdl.handle.net/10722/158437
ISSN
2013 SCImago Journal Rankings: 0.203
References

 

Author Affiliations
  1. ASM Assembly Automation Ltd.
  2. The University of Hong Kong
  3. Xi'an Jiaotong University
  4. Chinese University of Hong Kong
DC FieldValueLanguage
dc.contributor.authorShu, Yen_US
dc.contributor.authorChung, Ren_US
dc.contributor.authorTan, Zen_US
dc.contributor.authorCheng, Jen_US
dc.contributor.authorLam, EYen_US
dc.contributor.authorFung, KSMen_US
dc.contributor.authorWang, Fen_US
dc.date.accessioned2012-08-08T08:59:37Z-
dc.date.available2012-08-08T08:59:37Z-
dc.date.issued2006en_US
dc.identifier.citationProceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6056en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/10722/158437-
dc.description.abstractA challenge in the semiconductor industry is the 3D inspection of solder bumps grown on wafers for direct die-to-die bonding. In an earlier work we proposed a mechanism for reconstructing wafer bump surface in 3D, which is based upon projecting a binary grating to the surface with an inclined angle. For the purpose of 3D reconstruction with high speed and accuracy, the requirements for the projection lens system are the followings: (1) having a tilted angle between the projection plane and the optical axis; (2) having high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) having high Modulation Transfer Function (MTF); (4) having large Field of View (FOV); and (5) having a large Depth of Field (DOF) that corresponds to the depth range or height of the inspected surface. The above requirements lead to great challenges in the design of the projection lens system. In this paper, we describe a design consisting of a grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with a tilting angle specifically to make the grating, the lens, and the image plane intersect at the same line. Such a system can project a high spatial-frequency binary grating onto the inspected surface properly. Simulation results, including performance analysis and tolerance analysis, are shown to demonstrate the feasibility of the design. © 2006 SPIE-IS&T.en_US
dc.languageengen_US
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xmlen_US
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_US
dc.subject3D From Structured Lighten_US
dc.subjectDepth Of Fielden_US
dc.subjectField Of Viewen_US
dc.subjectLens Designen_US
dc.subjectMachine Visionen_US
dc.subjectModulation Transfer Functionen_US
dc.titleA novel design of grating projection system for 3D reconstruction of wafer bumpsen_US
dc.typeConference_Paperen_US
dc.identifier.emailLam, EY:elam@eee.hku.hken_US
dc.identifier.authorityLam, EY=rp00131en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1117/12.650023en_US
dc.identifier.scopuseid_2-s2.0-33645504465en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33645504465&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume6056en_US
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridShu, Y=36906608600en_US
dc.identifier.scopusauthoridChung, R=7202439610en_US
dc.identifier.scopusauthoridTan, Z=7201599779en_US
dc.identifier.scopusauthoridCheng, J=14057685600en_US
dc.identifier.scopusauthoridLam, EY=7102890004en_US
dc.identifier.scopusauthoridFung, KSM=8627247700en_US
dc.identifier.scopusauthoridWang, F=7501312203en_US

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