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Conference Paper: Optimization of silicon Spreading-Resistance Temperature sensor
Title | Optimization of silicon Spreading-Resistance Temperature sensor |
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Authors | |
Issue Date | 2000 |
Citation | Proceedings Of The Ieee Hong Kong Electron Devices Meeting, 2000, p. 20-23 How to Cite? |
Abstract | The resistance-temperature (R-T) characteristics of silicon Spreading-Resistance Temperature (SRT) sensor have been investigated. Experiment results show that dimensions of the device structure, substrate doping strongly affect the maximum operating temperature, while processing conditions only have a slight effect. With appropriately small circular n+ region and high substrate doping, the SRT sensor can function at temperatures up to 400 °C at a low current of 2 mA. |
Persistent Identifier | http://hdl.handle.net/10722/158295 |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Li, Bin | en_US |
dc.contributor.author | Lai, PT | en_US |
dc.contributor.author | Chan, CL | en_US |
dc.contributor.author | Sin, JKO | en_US |
dc.date.accessioned | 2012-08-08T08:58:57Z | - |
dc.date.available | 2012-08-08T08:58:57Z | - |
dc.date.issued | 2000 | en_US |
dc.identifier.citation | Proceedings Of The Ieee Hong Kong Electron Devices Meeting, 2000, p. 20-23 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/158295 | - |
dc.description.abstract | The resistance-temperature (R-T) characteristics of silicon Spreading-Resistance Temperature (SRT) sensor have been investigated. Experiment results show that dimensions of the device structure, substrate doping strongly affect the maximum operating temperature, while processing conditions only have a slight effect. With appropriately small circular n+ region and high substrate doping, the SRT sensor can function at temperatures up to 400 °C at a low current of 2 mA. | en_US |
dc.language | eng | en_US |
dc.relation.ispartof | Proceedings of the IEEE Hong Kong Electron Devices Meeting | en_US |
dc.title | Optimization of silicon Spreading-Resistance Temperature sensor | en_US |
dc.type | Conference_Paper | en_US |
dc.identifier.email | Lai, PT:laip@eee.hku.hk | en_US |
dc.identifier.authority | Lai, PT=rp00130 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.scopus | eid_2-s2.0-0034476055 | en_US |
dc.identifier.spage | 20 | en_US |
dc.identifier.epage | 23 | en_US |
dc.identifier.scopusauthorid | Li, Bin=26643217800 | en_US |
dc.identifier.scopusauthorid | Lai, PT=7202946460 | en_US |
dc.identifier.scopusauthorid | Chan, CL=8507083700 | en_US |
dc.identifier.scopusauthorid | Sin, JKO=7103312667 | en_US |