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Article: Copper nanofluids: Synthesis and thermal conductivity

TitleCopper nanofluids: Synthesis and thermal conductivity
Authors
KeywordsChemical Stability
Colloidal Stability
Copper Nanofluids
One-Step Chemical Reduction
Thermal Conductivity
Issue Date2010
PublisherBentham Science Publishers Ltd. The Journal's web site is located at http://www.bentham.org/cnano/index.htm
Citation
Current Nanoscience, 2010, v. 6 n. 5, p. 512-519 How to Cite?
AbstractA novel one-step chemical reduction method is developed to fabricate nanofluids with very tiny spherical copper nanoparticles. Their chemical and colloidal stability is studied by adjusting their pH value with citric acid. Their thermal conductivity is also measured by the transient hot-wire method. The particle size can be varied from 6.4 nm to 2.9 nm by changing the surfactant concentration. The thermal conductivity data show the existence of a critical particle size below which the nanoparticles cannot significantly enhance fluid conductivity due to the particle conductivity reduction and the solid-liquid interfacial thermal resistance increase as the particle size decreases. By considering these two factors, we have also made some theoretical analysis to find the possible critical particle size. © 2010 Bentham Science Publishers Ltd.
Persistent Identifierhttp://hdl.handle.net/10722/157086
ISSN
2015 Impact Factor: 0.934
2015 SCImago Journal Rankings: 0.283
References

 

DC FieldValueLanguage
dc.contributor.authorJiang, Wen_US
dc.contributor.authorWang, Len_US
dc.date.accessioned2012-08-08T08:45:15Z-
dc.date.available2012-08-08T08:45:15Z-
dc.date.issued2010en_US
dc.identifier.citationCurrent Nanoscience, 2010, v. 6 n. 5, p. 512-519en_US
dc.identifier.issn1573-4137en_US
dc.identifier.urihttp://hdl.handle.net/10722/157086-
dc.description.abstractA novel one-step chemical reduction method is developed to fabricate nanofluids with very tiny spherical copper nanoparticles. Their chemical and colloidal stability is studied by adjusting their pH value with citric acid. Their thermal conductivity is also measured by the transient hot-wire method. The particle size can be varied from 6.4 nm to 2.9 nm by changing the surfactant concentration. The thermal conductivity data show the existence of a critical particle size below which the nanoparticles cannot significantly enhance fluid conductivity due to the particle conductivity reduction and the solid-liquid interfacial thermal resistance increase as the particle size decreases. By considering these two factors, we have also made some theoretical analysis to find the possible critical particle size. © 2010 Bentham Science Publishers Ltd.en_US
dc.languageengen_US
dc.publisherBentham Science Publishers Ltd. The Journal's web site is located at http://www.bentham.org/cnano/index.htmen_US
dc.relation.ispartofCurrent Nanoscienceen_US
dc.subjectChemical Stabilityen_US
dc.subjectColloidal Stabilityen_US
dc.subjectCopper Nanofluidsen_US
dc.subjectOne-Step Chemical Reductionen_US
dc.subjectThermal Conductivityen_US
dc.titleCopper nanofluids: Synthesis and thermal conductivityen_US
dc.typeArticleen_US
dc.identifier.emailWang, L:lqwang@hkucc.hku.hken_US
dc.identifier.authorityWang, L=rp00184en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-77958504778en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77958504778&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume6en_US
dc.identifier.issue5en_US
dc.identifier.spage512en_US
dc.identifier.epage519en_US
dc.publisher.placeNetherlandsen_US
dc.identifier.scopusauthoridJiang, W=36079060300en_US
dc.identifier.scopusauthoridWang, L=35235288500en_US

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