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Article: Behavior modeling of laser micromachining in hybrid-layered manufacturing for components made of a material with a periodic microstructure

TitleBehavior modeling of laser micromachining in hybrid-layered manufacturing for components made of a material with a periodic microstructure
Authors
KeywordsBehavior modeling
Heterogeneous materials with a periodic microstructure
Hybrid-layered manufacturing
Laser micromachining
Issue Date2008
PublisherSpringer U K. The Journal's web site is located at http://www.springer.com/engineering/production+eng/journal/170
Citation
International Journal of Advanced Manufacturing Technology, 2008, v. 38 n. 1-2, p. 85-92 How to Cite?
AbstractA heterogeneous material with a certain periodic microstructure may have specific properties, such as negative Poisson's ratio and zero thermal expansion coefficients, which can satisfy some requirement of high technology. However, currently research about how to fabricate such 3-D periodic microstructures is rarely reported in the published literature and only some 2D fabrication procedures were developed. To fabricate such components, a hybrid-layered manufacturing process has been developed and applies spraying, engraving, and refinishing technologies, among which the engraving is the key technology for generating the voids of periodic microstructures with their required dimensions and accuracies. To implement such an accurate engraving, it is important to study its engraving behavior. This paper establishes a behavior model of the engraving operation and performs its behavior simulation, thus providing a reliable basis for future practical manufacturing. © 2007 Springer-Verlag London Limited.
Persistent Identifierhttp://hdl.handle.net/10722/156970
ISSN
2021 Impact Factor: 3.563
2020 SCImago Journal Rankings: 0.946
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorWang, Fen_HK
dc.contributor.authorChen, KZen_HK
dc.contributor.authorFeng, XAen_HK
dc.date.accessioned2012-08-08T08:44:45Z-
dc.date.available2012-08-08T08:44:45Z-
dc.date.issued2008en_HK
dc.identifier.citationInternational Journal of Advanced Manufacturing Technology, 2008, v. 38 n. 1-2, p. 85-92en_HK
dc.identifier.issn0268-3768en_HK
dc.identifier.urihttp://hdl.handle.net/10722/156970-
dc.description.abstractA heterogeneous material with a certain periodic microstructure may have specific properties, such as negative Poisson's ratio and zero thermal expansion coefficients, which can satisfy some requirement of high technology. However, currently research about how to fabricate such 3-D periodic microstructures is rarely reported in the published literature and only some 2D fabrication procedures were developed. To fabricate such components, a hybrid-layered manufacturing process has been developed and applies spraying, engraving, and refinishing technologies, among which the engraving is the key technology for generating the voids of periodic microstructures with their required dimensions and accuracies. To implement such an accurate engraving, it is important to study its engraving behavior. This paper establishes a behavior model of the engraving operation and performs its behavior simulation, thus providing a reliable basis for future practical manufacturing. © 2007 Springer-Verlag London Limited.en_HK
dc.languageengen_US
dc.publisherSpringer U K. The Journal's web site is located at http://www.springer.com/engineering/production+eng/journal/170en_HK
dc.relation.ispartofInternational Journal of Advanced Manufacturing Technologyen_HK
dc.subjectBehavior modelingen_HK
dc.subjectHeterogeneous materials with a periodic microstructureen_HK
dc.subjectHybrid-layered manufacturingen_HK
dc.subjectLaser micromachiningen_HK
dc.titleBehavior modeling of laser micromachining in hybrid-layered manufacturing for components made of a material with a periodic microstructureen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, KZ: kzchen188@gmail.comen_HK
dc.identifier.authorityChen, KZ=rp00097en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1007/s00170-007-1088-7en_HK
dc.identifier.scopuseid_2-s2.0-46849093209en_HK
dc.identifier.hkuros154788-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-46849093209&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume38en_HK
dc.identifier.issue1-2en_HK
dc.identifier.spage85en_HK
dc.identifier.epage92en_HK
dc.identifier.isiWOS:000257394100010-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridWang, F=7501312906en_HK
dc.identifier.scopusauthoridChen, KZ=7410237952en_HK
dc.identifier.scopusauthoridFeng, XA=7403047129en_HK
dc.identifier.citeulike3094993-
dc.identifier.issnl0268-3768-

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