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Article: The competition between Brownian motion and adhesion in soft materials

TitleThe competition between Brownian motion and adhesion in soft materials
Authors
KeywordsAdhesion
Bonding
Brownian Mechanics
Soft Materials
Statistical Mechanics
Issue Date2008
PublisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jmps
Citation
Journal Of The Mechanics And Physics Of Solids, 2008, v. 56 n. 1, p. 241-250 How to Cite?
AbstractThe phenomenon considered is the potential for adhesion between a membrane and a nearby substrate through bonding of receptor molecules in the membrane to ligand molecules on the substrate. The membrane is immersed in a thermal reservoir and, consequently, experiences thermal undulations. The undulations must be suppressed in order to effect bonding, and this competition is the focus of the present discussion. A simple physical model is introduced which incorporates thermal motion of a one-dimensional membrane, and its tendency for bonding is represented by an interaction potential with the substrate. The model is analyzed within the framework of classical statistical mechanics, based on a description of adhesion in terms of the standard deviation of the membrane at the potential bonding points. The principal result is in the form of a quantitative relationship between the membrane span and the depth of the bonding potential that must be satisfied in order for bonding to be completed. © 2007 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/156934
ISSN
2015 Impact Factor: 3.875
2015 SCImago Journal Rankings: 2.529
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorLin, Yen_US
dc.contributor.authorInamdar, Men_US
dc.contributor.authorFreund, LBen_US
dc.date.accessioned2012-08-08T08:44:36Z-
dc.date.available2012-08-08T08:44:36Z-
dc.date.issued2008en_US
dc.identifier.citationJournal Of The Mechanics And Physics Of Solids, 2008, v. 56 n. 1, p. 241-250en_US
dc.identifier.issn0022-5096en_US
dc.identifier.urihttp://hdl.handle.net/10722/156934-
dc.description.abstractThe phenomenon considered is the potential for adhesion between a membrane and a nearby substrate through bonding of receptor molecules in the membrane to ligand molecules on the substrate. The membrane is immersed in a thermal reservoir and, consequently, experiences thermal undulations. The undulations must be suppressed in order to effect bonding, and this competition is the focus of the present discussion. A simple physical model is introduced which incorporates thermal motion of a one-dimensional membrane, and its tendency for bonding is represented by an interaction potential with the substrate. The model is analyzed within the framework of classical statistical mechanics, based on a description of adhesion in terms of the standard deviation of the membrane at the potential bonding points. The principal result is in the form of a quantitative relationship between the membrane span and the depth of the bonding potential that must be satisfied in order for bonding to be completed. © 2007 Elsevier Ltd. All rights reserved.en_US
dc.languageengen_US
dc.publisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jmpsen_US
dc.relation.ispartofJournal of the Mechanics and Physics of Solidsen_US
dc.subjectAdhesionen_US
dc.subjectBondingen_US
dc.subjectBrownian Mechanicsen_US
dc.subjectSoft Materialsen_US
dc.subjectStatistical Mechanicsen_US
dc.titleThe competition between Brownian motion and adhesion in soft materialsen_US
dc.typeArticleen_US
dc.identifier.emailLin, Y:ylin@hku.hken_US
dc.identifier.authorityLin, Y=rp00080en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1016/j.jmps.2007.02.008en_US
dc.identifier.scopuseid_2-s2.0-37849009749en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-37849009749&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume56en_US
dc.identifier.issue1en_US
dc.identifier.spage241en_US
dc.identifier.epage250en_US
dc.identifier.isiWOS:000253178200016-
dc.publisher.placeUnited Kingdomen_US
dc.identifier.scopusauthoridLin, Y=7406585339en_US
dc.identifier.scopusauthoridInamdar, M=8626754800en_US
dc.identifier.scopusauthoridFreund, LB=7102315296en_US

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