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Article: Fully elastic interconnects on nanopatterned elastomeric substrates

TitleFully elastic interconnects on nanopatterned elastomeric substrates
Authors
Mandlik, PLacour, SPLi, JWChou, SYWagner, S
KeywordsFlexible Structures
Nanotechnology
Silicone Rubber
Thin-Film Circuit Interconnections
Issue Date2006
PublisherI E E E. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=55
Citation
Ieee Electron Device Letters, 2006, v. 27 n. 8, p. 650-652 How to Cite?
DOI: http://dx.doi.org/10.1109/LED.2006.879029
AbstractElastically stretchable metal interconnects are required for electronic skin. To date, the resistance of such thin-film interconnects has been found to increase much more with mechanical strain than expected from purely geometrical deformation of the conductor. It has been discovered that the resistance change due to fully elastic deformation is minimal when the metal films are deposited on pyramidal nanopatterned surfaces. The nanopattern constrains the film to purely elastic deformation by localizing the microcracks that are formed in the conductor during stretching. Between 0% and 25% mechanical strain, the electrical resistance increases by only 60%, which is in close agreement with purely geometric deformation. © 2006 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/156838
ISSN
0741-3106
2023 Impact Factor: 4.1
2023 SCImago Journal Rankings: 1.250
ISI Accession Number ID
WOS:000239440700006
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorMandlik, Pen_US
dc.contributor.authorLacour, SPen_US
dc.contributor.authorLi, JWen_US
dc.contributor.authorChou, SYen_US
dc.contributor.authorWagner, Sen_US
dc.date.accessioned2012-08-08T08:44:11Z-
dc.date.available2012-08-08T08:44:11Z-
dc.date.issued2006en_US
dc.identifier.citationIeee Electron Device Letters, 2006, v. 27 n. 8, p. 650-652en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://hdl.handle.net/10722/156838-
dc.description.abstractElastically stretchable metal interconnects are required for electronic skin. To date, the resistance of such thin-film interconnects has been found to increase much more with mechanical strain than expected from purely geometrical deformation of the conductor. It has been discovered that the resistance change due to fully elastic deformation is minimal when the metal films are deposited on pyramidal nanopatterned surfaces. The nanopattern constrains the film to purely elastic deformation by localizing the microcracks that are formed in the conductor during stretching. Between 0% and 25% mechanical strain, the electrical resistance increases by only 60%, which is in close agreement with purely geometric deformation. © 2006 IEEE.en_US
dc.languageengen_US
dc.publisherI E E E. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=55en_US
dc.relation.ispartofIEEE Electron Device Lettersen_US
dc.subjectFlexible Structuresen_US
dc.subjectNanotechnologyen_US
dc.subjectSilicone Rubberen_US
dc.subjectThin-Film Circuit Interconnectionsen_US
dc.titleFully elastic interconnects on nanopatterned elastomeric substratesen_US
dc.typeArticleen_US
dc.identifier.emailLi, JW:liwd@hku.hken_US
dc.identifier.authorityLi, JW=rp01581en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/LED.2006.879029en_US
dc.identifier.scopuseid_2-s2.0-33746486815en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33746486815&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume27en_US
dc.identifier.issue8en_US
dc.identifier.spage650en_US
dc.identifier.epage652en_US
dc.identifier.isiWOS:000239440700006-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridMandlik, P=36962932800en_US
dc.identifier.scopusauthoridLacour, SP=35583401000en_US
dc.identifier.scopusauthoridLi, JW=35181575900en_US
dc.identifier.scopusauthoridChou, SY=7401538612en_US
dc.identifier.scopusauthoridWagner, S=7402231247en_US
dc.identifier.issnl0741-3106-

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