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Article: Crystalline plasticity on copper (001), (110), and (111) surfaces during nanoindentation

TitleCrystalline plasticity on copper (001), (110), and (111) surfaces during nanoindentation
Authors
KeywordsAnisotropy
Molecular Dynamics
Nanoindentation
Issue Date2004
PublisherTech Science Press. The Journal's web site is located at http://www.techscience.com/cmes/index.html
Citation
Cmes - Computer Modeling In Engineering And Sciences, 2004, v. 6 n. 1, p. 105-114 How to Cite?
AbstractMolecular dynamics (MD) simulations are performed to study crystalline plasticity during nanoindentation by comparing the elastic-plastic response of three copper substrates with surfaces (001), (110), and (111) crystallographic planes. The effects of elastic anisotropy and crystallographic symmetry on the reduced modulus, dislocation nucleation, and subsequent microstructure evolution, are investigated. The reduced modulus of (111) surface is found to be the largest, while that of (001) surface is the smallest. Elastic stress distribution calculated from finite element method (FEM) is qualitatively consistent with the MD simulation results. Significant differences exist in the deformation behavior in the three different crystallographic orientations. The differences in the load-displacement curves for the three different cases are correlated with those in the corresponding evolutions of the underlying dislocation structure. Yielding platforms exist typically in load-displacement curve of Cu (001), which can be attributed to effective resistance of dislocation locks. Load drops are typically characteristic of Cu (111) and (110), due to a more mobile dislocation structure.
Persistent Identifierhttp://hdl.handle.net/10722/156816
ISSN
2015 Impact Factor: 0.841
2015 SCImago Journal Rankings: 0.858
References

 

DC FieldValueLanguage
dc.contributor.authorLiang, Hen_US
dc.contributor.authorWoo, CHen_US
dc.contributor.authorHuang, Hen_US
dc.contributor.authorNgan, AHWen_US
dc.contributor.authorYu, TXen_US
dc.date.accessioned2012-08-08T08:44:05Z-
dc.date.available2012-08-08T08:44:05Z-
dc.date.issued2004en_US
dc.identifier.citationCmes - Computer Modeling In Engineering And Sciences, 2004, v. 6 n. 1, p. 105-114en_US
dc.identifier.issn1526-1492en_US
dc.identifier.urihttp://hdl.handle.net/10722/156816-
dc.description.abstractMolecular dynamics (MD) simulations are performed to study crystalline plasticity during nanoindentation by comparing the elastic-plastic response of three copper substrates with surfaces (001), (110), and (111) crystallographic planes. The effects of elastic anisotropy and crystallographic symmetry on the reduced modulus, dislocation nucleation, and subsequent microstructure evolution, are investigated. The reduced modulus of (111) surface is found to be the largest, while that of (001) surface is the smallest. Elastic stress distribution calculated from finite element method (FEM) is qualitatively consistent with the MD simulation results. Significant differences exist in the deformation behavior in the three different crystallographic orientations. The differences in the load-displacement curves for the three different cases are correlated with those in the corresponding evolutions of the underlying dislocation structure. Yielding platforms exist typically in load-displacement curve of Cu (001), which can be attributed to effective resistance of dislocation locks. Load drops are typically characteristic of Cu (111) and (110), due to a more mobile dislocation structure.en_US
dc.languageengen_US
dc.publisherTech Science Press. The Journal's web site is located at http://www.techscience.com/cmes/index.htmlen_US
dc.relation.ispartofCMES - Computer Modeling in Engineering and Sciencesen_US
dc.subjectAnisotropyen_US
dc.subjectMolecular Dynamicsen_US
dc.subjectNanoindentationen_US
dc.titleCrystalline plasticity on copper (001), (110), and (111) surfaces during nanoindentationen_US
dc.typeArticleen_US
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_US
dc.identifier.authorityNgan, AHW=rp00225en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-3242689046en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-3242689046&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume6en_US
dc.identifier.issue1en_US
dc.identifier.spage105en_US
dc.identifier.epage114en_US
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridLiang, H=7402853728en_US
dc.identifier.scopusauthoridWoo, CH=26423402100en_US
dc.identifier.scopusauthoridHuang, H=7405612816en_US
dc.identifier.scopusauthoridNgan, AHW=7006827202en_US
dc.identifier.scopusauthoridYu, TX=13105002800en_US

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