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Article: An improved photo-elastic technique for determining the mixed-mode stress-intensity factors for interfacial cracks in a bi-material

TitleAn improved photo-elastic technique for determining the mixed-mode stress-intensity factors for interfacial cracks in a bi-material
Authors
Soh, AK
KeywordsBi-Material
Complex Potentials
Interfacial Cracks
Least Square Method
Photo-Elastic Technique
Stress Intensity Factors
Issue Date1999
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/compscitech
Citation
Composites Science And Technology, 1999, v. 59 n. 7, p. 1033-1039 How to Cite?
DOI: http://dx.doi.org/10.1016/S0266-3538(98)00142-0
AbstractAttempts to employ the photo-elastic technique to determine the complex stress-intensity factors of interfacial cracks in a bi-material reveal the weakness of the technique. This weakness is due to the large errors arising from the measurement of the coordinates of data points and fringe orders near the crack tip. In this paper, an improved photo-elastic approach is proposed to reduce the effects of the measurement errors. The results obtained by this modified method are compared with both a traditional photo-elastic solution and a theoretical solution derived from complex potentials. The comparison shows that the modified solution is in better agreement with the theoretical solution as compared with the traditional solution.
Persistent Identifierhttp://hdl.handle.net/10722/156505
ISSN
0266-3538
2023 Impact Factor: 8.3
2023 SCImago Journal Rankings: 1.800
ISI Accession Number ID
WOS:000080509200006
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorSoh, AKen_US
dc.date.accessioned2012-08-08T08:42:43Z-
dc.date.available2012-08-08T08:42:43Z-
dc.date.issued1999en_US
dc.identifier.citationComposites Science And Technology, 1999, v. 59 n. 7, p. 1033-1039en_US
dc.identifier.issn0266-3538en_US
dc.identifier.urihttp://hdl.handle.net/10722/156505-
dc.description.abstractAttempts to employ the photo-elastic technique to determine the complex stress-intensity factors of interfacial cracks in a bi-material reveal the weakness of the technique. This weakness is due to the large errors arising from the measurement of the coordinates of data points and fringe orders near the crack tip. In this paper, an improved photo-elastic approach is proposed to reduce the effects of the measurement errors. The results obtained by this modified method are compared with both a traditional photo-elastic solution and a theoretical solution derived from complex potentials. The comparison shows that the modified solution is in better agreement with the theoretical solution as compared with the traditional solution.en_US
dc.languageengen_US
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/compscitechen_US
dc.relation.ispartofComposites Science and Technologyen_US
dc.subjectBi-Materialen_US
dc.subjectComplex Potentialsen_US
dc.subjectInterfacial Cracksen_US
dc.subjectLeast Square Methoden_US
dc.subjectPhoto-Elastic Techniqueen_US
dc.subjectStress Intensity Factorsen_US
dc.titleAn improved photo-elastic technique for determining the mixed-mode stress-intensity factors for interfacial cracks in a bi-materialen_US
dc.typeArticleen_US
dc.identifier.emailSoh, AK:aksoh@hkucc.hku.hken_US
dc.identifier.authoritySoh, AK=rp00170en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1016/S0266-3538(98)00142-0-
dc.identifier.scopuseid_2-s2.0-0032678591en_US
dc.identifier.hkuros41063-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0032678591&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume59en_US
dc.identifier.issue7en_US
dc.identifier.spage1033en_US
dc.identifier.epage1039en_US
dc.identifier.isiWOS:000080509200006-
dc.publisher.placeUnited Kingdomen_US
dc.identifier.scopusauthoridSoh, AK=7006795203en_US
dc.identifier.issnl0266-3538-

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