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Article: Cooling rate effect on post cure stresses in molded plastic IC packages

TitleCooling rate effect on post cure stresses in molded plastic IC packages
Authors
Issue Date1998
PublisherA S M E International. The Journal's web site is located at http://ojps.aip.org/ASMEJournals/ElectronicPackaging
Citation
Journal Of Electronic Packaging, Transactions Of The Asme, 1998, v. 120 n. 4, p. 385-390 How to Cite?
AbstractResidual stresses during cool down process after curing are evaluated on the basis of thermoviscoelastic finite element analyses with material properties dependent on both time and temperature. Temperature distributions in packages are predicted by solving the heat conduction equations. The effects of cool-down history on thermomechanical responses of a lead-on-chip (LOC), thin small outline package (TSOP) are investigated. Three linear cool down temperature histories are considered. Numerical results show that residual stresses in a LOC TSOP are significantly influenced by the manufacturing temperature history. Residual stresses in plastic packages are strongly time-temperature dependent due to the thermoviscoelastic behavior of molding compounds. Substantial residual stresses arise when a LOC TSOP has cooled to room temperature and rapid cool down permits small viscoelastic effects.
Persistent Identifierhttp://hdl.handle.net/10722/156492
ISSN
2015 Impact Factor: 1.402
2015 SCImago Journal Rankings: 0.542

 

DC FieldValueLanguage
dc.contributor.authorYi, Sen_US
dc.contributor.authorSze, KYen_US
dc.date.accessioned2012-08-08T08:42:40Z-
dc.date.available2012-08-08T08:42:40Z-
dc.date.issued1998en_US
dc.identifier.citationJournal Of Electronic Packaging, Transactions Of The Asme, 1998, v. 120 n. 4, p. 385-390en_US
dc.identifier.issn1043-7398en_US
dc.identifier.urihttp://hdl.handle.net/10722/156492-
dc.description.abstractResidual stresses during cool down process after curing are evaluated on the basis of thermoviscoelastic finite element analyses with material properties dependent on both time and temperature. Temperature distributions in packages are predicted by solving the heat conduction equations. The effects of cool-down history on thermomechanical responses of a lead-on-chip (LOC), thin small outline package (TSOP) are investigated. Three linear cool down temperature histories are considered. Numerical results show that residual stresses in a LOC TSOP are significantly influenced by the manufacturing temperature history. Residual stresses in plastic packages are strongly time-temperature dependent due to the thermoviscoelastic behavior of molding compounds. Substantial residual stresses arise when a LOC TSOP has cooled to room temperature and rapid cool down permits small viscoelastic effects.en_US
dc.languageengen_US
dc.publisherA S M E International. The Journal's web site is located at http://ojps.aip.org/ASMEJournals/ElectronicPackagingen_US
dc.relation.ispartofJournal of Electronic Packaging, Transactions of the ASMEen_US
dc.titleCooling rate effect on post cure stresses in molded plastic IC packagesen_US
dc.typeArticleen_US
dc.identifier.emailSze, KY:szeky@graduate.hku.hken_US
dc.identifier.authoritySze, KY=rp00171en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0032293107en_US
dc.identifier.hkuros41159-
dc.identifier.volume120en_US
dc.identifier.issue4en_US
dc.identifier.spage385en_US
dc.identifier.epage390en_US
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridYi, S=7201404653en_US
dc.identifier.scopusauthoridSze, KY=7006735060en_US

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