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Article: CAD/CAM (COMPUTER-AIDED DESIGN AND COMPUTER-AIDED MANUFACTURE) WHAT? WHICH? AND HOW?

TitleCAD/CAM (COMPUTER-AIDED DESIGN AND COMPUTER-AIDED MANUFACTURE) WHAT? WHICH? AND HOW?
Authors
Issue Date1987
Citation
Hong Kong Engineer, 1987, v. 15 n. 3, p. 21-26, 36 How to Cite?
AbstractThe paper provides an introduction to the terminology used in CADCAM modelling systems, discusses the various underlying geometric modelling principles, and the capabilities and deficiencies of the systems which have been derived on the basis of these principles. Some of the mechanical engineering applications of these systems are illustrated. The authors' view on the criteria for selecting a CADCAM system, with particular reference to the Hong Kong environment, are also presented. Finally, future trends and research in the CADCAM field are discussed.
Persistent Identifierhttp://hdl.handle.net/10722/156317
ISSN

 

DC FieldValueLanguage
dc.contributor.authorTan, STen_US
dc.contributor.authorYeun, MMFen_US
dc.contributor.authorSze, WSen_US
dc.date.accessioned2012-08-08T08:41:57Z-
dc.date.available2012-08-08T08:41:57Z-
dc.date.issued1987en_US
dc.identifier.citationHong Kong Engineer, 1987, v. 15 n. 3, p. 21-26, 36en_US
dc.identifier.issn0378-8776en_US
dc.identifier.urihttp://hdl.handle.net/10722/156317-
dc.description.abstractThe paper provides an introduction to the terminology used in CADCAM modelling systems, discusses the various underlying geometric modelling principles, and the capabilities and deficiencies of the systems which have been derived on the basis of these principles. Some of the mechanical engineering applications of these systems are illustrated. The authors' view on the criteria for selecting a CADCAM system, with particular reference to the Hong Kong environment, are also presented. Finally, future trends and research in the CADCAM field are discussed.en_US
dc.languageengen_US
dc.relation.ispartofHong Kong engineeren_US
dc.titleCAD/CAM (COMPUTER-AIDED DESIGN AND COMPUTER-AIDED MANUFACTURE) WHAT? WHICH? AND HOW?en_US
dc.typeArticleen_US
dc.identifier.emailTan, ST:sttan@hkucc.hku.hken_US
dc.identifier.emailSze, WS:wssze@hkucc.hku.hken_US
dc.identifier.authorityTan, ST=rp00174en_US
dc.identifier.authoritySze, WS=rp00172en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0023309490en_US
dc.identifier.volume15en_US
dc.identifier.issue3en_US
dc.identifier.spage21en_US
dc.identifier.epage26, 36en_US
dc.identifier.scopusauthoridTan, ST=7403366758en_US
dc.identifier.scopusauthoridYeun, MMF=6504490564en_US
dc.identifier.scopusauthoridSze, WS=7003795945en_US

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