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Article: Height inspection of wafer bumps without explicit 3-D reconstruction

TitleHeight inspection of wafer bumps without explicit 3-D reconstruction
Authors
KeywordsBall Bumps
Bump Height Inspection
Homography
Specular Surface
Wafer Bumps
Issue Date2010
Citation
Ieee Transactions On Electronics Packaging Manufacturing, 2010, v. 33 n. 2, p. 112-121 How to Cite?
AbstractDie bonding in the semiconductor industry requires placement of solder bumps not on PCBs but on wafers. Such wafer bumps, which are much miniaturized from their counterparts on printed circuit boards (PCBs), require their heights meet rigid specifications. Yet the small size, the lack of texture, and the mirror-like nature of the bump surface make the inspection task a challenge. Existing inspection schemes generally reconstruct every bump surface. This work addresses by how much can the task be simplified if merely the bump heights are inspected against the specification. It is assumed that ball bumps are used as the wafer bumps. An imaging setup is described that lets the peaks of the ball bumps be distinguishable in the image data. A measure is also described that reveals how well the ball bumps meet the height specification without going through explicit 3-D reconstruction. The measurement, in the form of a 3 × 3 matrix extractable from the image data, is sensitive to variations in the bump heights, but not to 2-D uncertainties in soldering the bumps onto the wafer substrate, or small variations in the placement of the wafer in 3-D. Experimental results are shown to illustrate the effectiveness of the proposed system. © 2010 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/155575
ISSN
2010 Impact Factor: 0.892
2013 SCImago Journal Rankings: 0.347
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorDong, Men_US
dc.contributor.authorChung, Ren_US
dc.contributor.authorLam, EYen_US
dc.contributor.authorFung, KSMen_US
dc.date.accessioned2012-08-08T08:34:10Z-
dc.date.available2012-08-08T08:34:10Z-
dc.date.issued2010en_US
dc.identifier.citationIeee Transactions On Electronics Packaging Manufacturing, 2010, v. 33 n. 2, p. 112-121en_US
dc.identifier.issn1521-334Xen_US
dc.identifier.urihttp://hdl.handle.net/10722/155575-
dc.description.abstractDie bonding in the semiconductor industry requires placement of solder bumps not on PCBs but on wafers. Such wafer bumps, which are much miniaturized from their counterparts on printed circuit boards (PCBs), require their heights meet rigid specifications. Yet the small size, the lack of texture, and the mirror-like nature of the bump surface make the inspection task a challenge. Existing inspection schemes generally reconstruct every bump surface. This work addresses by how much can the task be simplified if merely the bump heights are inspected against the specification. It is assumed that ball bumps are used as the wafer bumps. An imaging setup is described that lets the peaks of the ball bumps be distinguishable in the image data. A measure is also described that reveals how well the ball bumps meet the height specification without going through explicit 3-D reconstruction. The measurement, in the form of a 3 × 3 matrix extractable from the image data, is sensitive to variations in the bump heights, but not to 2-D uncertainties in soldering the bumps onto the wafer substrate, or small variations in the placement of the wafer in 3-D. Experimental results are shown to illustrate the effectiveness of the proposed system. © 2010 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofIEEE Transactions on Electronics Packaging Manufacturingen_US
dc.subjectBall Bumpsen_US
dc.subjectBump Height Inspectionen_US
dc.subjectHomographyen_US
dc.subjectSpecular Surfaceen_US
dc.subjectWafer Bumpsen_US
dc.titleHeight inspection of wafer bumps without explicit 3-D reconstructionen_US
dc.typeArticleen_US
dc.identifier.emailLam, EY:elam@eee.hku.hken_US
dc.identifier.authorityLam, EY=rp00131en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/TEPM.2010.2043361en_US
dc.identifier.scopuseid_2-s2.0-77955088174en_US
dc.identifier.hkuros171686-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77955088174&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume33en_US
dc.identifier.issue2en_US
dc.identifier.spage112en_US
dc.identifier.epage121en_US
dc.identifier.isiWOS:000276270800005-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridDong, M=55136709200en_US
dc.identifier.scopusauthoridChung, R=7202439610en_US
dc.identifier.scopusauthoridLam, EY=7102890004en_US
dc.identifier.scopusauthoridFung, KSM=8627247700en_US

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