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Article: Toward a more robust and accurate CEM fast integral equation solver for IC applications

TitleToward a more robust and accurate CEM fast integral equation solver for IC applications
Authors
KeywordsFast real-time convolution
Integral equation
Lithography
Method of moments (MoM)
Multilevel fast multipole algorithm (MLFMA)
Issue Date2005
Citation
Ieee Transactions On Advanced Packaging, 2005, v. 28 n. 3, p. 449-464 How to Cite?
AbstractWe review recent advances in fast algorithms for fast integral equation solvers that are useful for IC applications. We review fast solvers for Laplace's equation, which is about 10 times faster than the conventional fast multipole method. Then we review the physics of low-frequency electromagnetics, and the relevant low-frequency method of moments. We describe a fast solver that allows us to solve over one million unknowns on a workstation recently. In addition, we demonstrate the applications of these fast integral equation solvers to the lithography problem. In addition, we propose a scheme whereby we first characterize blocks of linear circuits with network S, Y, or Z parameters. Then a fast real-time convolution scheme is used to calculate the interaction of a linear circuit with nonlinear terminations such as transistors and diodes. Such a scheme requires no model-order reduction of the circuit. © 2005 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/155287
ISSN
2010 Impact Factor: 1.339
2013 SCImago Journal Rankings: 0.599
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorChew, WCen_HK
dc.contributor.authorJiang, LJen_HK
dc.contributor.authorChu, YHen_HK
dc.contributor.authorWang, GLen_HK
dc.contributor.authorChiang, ITen_HK
dc.contributor.authorPan, YCen_HK
dc.contributor.authorZhao, JSen_HK
dc.date.accessioned2012-08-08T08:32:43Z-
dc.date.available2012-08-08T08:32:43Z-
dc.date.issued2005en_HK
dc.identifier.citationIeee Transactions On Advanced Packaging, 2005, v. 28 n. 3, p. 449-464en_HK
dc.identifier.issn1521-3323en_HK
dc.identifier.urihttp://hdl.handle.net/10722/155287-
dc.description.abstractWe review recent advances in fast algorithms for fast integral equation solvers that are useful for IC applications. We review fast solvers for Laplace's equation, which is about 10 times faster than the conventional fast multipole method. Then we review the physics of low-frequency electromagnetics, and the relevant low-frequency method of moments. We describe a fast solver that allows us to solve over one million unknowns on a workstation recently. In addition, we demonstrate the applications of these fast integral equation solvers to the lithography problem. In addition, we propose a scheme whereby we first characterize blocks of linear circuits with network S, Y, or Z parameters. Then a fast real-time convolution scheme is used to calculate the interaction of a linear circuit with nonlinear terminations such as transistors and diodes. Such a scheme requires no model-order reduction of the circuit. © 2005 IEEE.en_HK
dc.languageengen_US
dc.relation.ispartofIEEE Transactions on Advanced Packagingen_HK
dc.subjectFast real-time convolutionen_HK
dc.subjectIntegral equationen_HK
dc.subjectLithographyen_HK
dc.subjectMethod of moments (MoM)en_HK
dc.subjectMultilevel fast multipole algorithm (MLFMA)en_HK
dc.titleToward a more robust and accurate CEM fast integral equation solver for IC applicationsen_HK
dc.typeArticleen_HK
dc.identifier.emailChew, WC: wcchew@hku.hken_HK
dc.identifier.emailJiang, LJ: jianglj@hku.hken_HK
dc.identifier.authorityChew, WC=rp00656en_HK
dc.identifier.authorityJiang, LJ=rp01338en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/TADVP.2005.848665en_HK
dc.identifier.scopuseid_2-s2.0-24644488919en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-24644488919&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume28en_HK
dc.identifier.issue3en_HK
dc.identifier.spage449en_HK
dc.identifier.epage464en_HK
dc.identifier.isiWOS:000231129200012-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridChew, WC=36014436300en_HK
dc.identifier.scopusauthoridJiang, LJ=36077777200en_HK
dc.identifier.scopusauthoridChu, YH=8688952100en_HK
dc.identifier.scopusauthoridWang, GL=36851528500en_HK
dc.identifier.scopusauthoridChiang, IT=7006017692en_HK
dc.identifier.scopusauthoridPan, YC=37043953800en_HK
dc.identifier.scopusauthoridZhao, JS=7410309451en_HK

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