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- Publisher Website: 10.1016/j.sse.2005.05.010
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Article: Effects of TCE concentration on oxide-charge and interface properties of SiO2 thermally grown on SiC
Title | Effects of TCE concentration on oxide-charge and interface properties of SiO2 thermally grown on SiC |
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Authors | |
Keywords | Flat-Band Voltage Interface-State Density Oxide-Charge Density Silicon Carbide Tce Oxidation |
Issue Date | 2005 |
Publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/sse |
Citation | Solid-State Electronics, 2005, v. 49 n. 7, p. 1223-1227 How to Cite? |
Abstract | The effects of trichloroethylene (TCE) concentration on the thermal oxidation of SiC are studied in terms of the oxide quality and the properties of the SiO2/SiC interface. It is found for the first time that as TCE concentration increases, the flat-band voltage, oxide-charge density and interface-state density all exhibit a turnaround behavior. For TCE ratio (flow rate of N2 + TCE to flow rate of O2) less than 0.01, the flat-band voltage increases with TCE concentration while the oxide-charge and interface-state densities decrease. However, for TCE ratio larger than 0.05, opposites occur with the flat-band voltage decreasing and the two densities increasing. The TCE-induced reductions of the oxide charges and interface states at 0.1-0.5 eV below the conduction-band edge are 93% and 24-99%, respectively, for a TCE ratio of 0.05. Moreover, as TCE ratio increases from 0 to 0.2, the oxide resistance against stress-induced damage increases. In summary, the TCE oxidation with appropriate TCE concentration can reduce the oxide charges and improve the interface properties and oxide reliability. © 2005 Elsevier Ltd. All rights reserved. |
Persistent Identifier | http://hdl.handle.net/10722/155275 |
ISSN | 2023 Impact Factor: 1.4 2023 SCImago Journal Rankings: 0.348 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yang, BL | en_US |
dc.contributor.author | Lin, LM | en_US |
dc.contributor.author | Lo, HB | en_US |
dc.contributor.author | Lai, PT | en_US |
dc.date.accessioned | 2012-08-08T08:32:40Z | - |
dc.date.available | 2012-08-08T08:32:40Z | - |
dc.date.issued | 2005 | en_US |
dc.identifier.citation | Solid-State Electronics, 2005, v. 49 n. 7, p. 1223-1227 | en_US |
dc.identifier.issn | 0038-1101 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/155275 | - |
dc.description.abstract | The effects of trichloroethylene (TCE) concentration on the thermal oxidation of SiC are studied in terms of the oxide quality and the properties of the SiO2/SiC interface. It is found for the first time that as TCE concentration increases, the flat-band voltage, oxide-charge density and interface-state density all exhibit a turnaround behavior. For TCE ratio (flow rate of N2 + TCE to flow rate of O2) less than 0.01, the flat-band voltage increases with TCE concentration while the oxide-charge and interface-state densities decrease. However, for TCE ratio larger than 0.05, opposites occur with the flat-band voltage decreasing and the two densities increasing. The TCE-induced reductions of the oxide charges and interface states at 0.1-0.5 eV below the conduction-band edge are 93% and 24-99%, respectively, for a TCE ratio of 0.05. Moreover, as TCE ratio increases from 0 to 0.2, the oxide resistance against stress-induced damage increases. In summary, the TCE oxidation with appropriate TCE concentration can reduce the oxide charges and improve the interface properties and oxide reliability. © 2005 Elsevier Ltd. All rights reserved. | en_US |
dc.language | eng | en_US |
dc.publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/sse | en_US |
dc.relation.ispartof | Solid-State Electronics | en_US |
dc.subject | Flat-Band Voltage | en_US |
dc.subject | Interface-State Density | en_US |
dc.subject | Oxide-Charge Density | en_US |
dc.subject | Silicon Carbide | en_US |
dc.subject | Tce Oxidation | en_US |
dc.title | Effects of TCE concentration on oxide-charge and interface properties of SiO2 thermally grown on SiC | en_US |
dc.type | Article | en_US |
dc.identifier.email | Lai, PT:laip@eee.hku.hk | en_US |
dc.identifier.authority | Lai, PT=rp00130 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.doi | 10.1016/j.sse.2005.05.010 | en_US |
dc.identifier.scopus | eid_2-s2.0-21444438448 | en_US |
dc.identifier.hkuros | 107288 | - |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-21444438448&selection=ref&src=s&origin=recordpage | en_US |
dc.identifier.volume | 49 | en_US |
dc.identifier.issue | 7 | en_US |
dc.identifier.spage | 1223 | en_US |
dc.identifier.epage | 1227 | en_US |
dc.identifier.isi | WOS:000230709100026 | - |
dc.publisher.place | United Kingdom | en_US |
dc.identifier.scopusauthorid | Yang, BL=24777588400 | en_US |
dc.identifier.scopusauthorid | Lin, LM=8642604900 | en_US |
dc.identifier.scopusauthorid | Lo, HB=7202085394 | en_US |
dc.identifier.scopusauthorid | Lai, PT=7202946460 | en_US |
dc.identifier.issnl | 0038-1101 | - |